Bhat, M. K.; Frommeyer, L.; Prithiv, T. S.; Dehm, G.; Best, J. P.: Using small-scale mechanics to probe the origins of segregation-induced strengthening. Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)
Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic scale observations of Ag segregation in a high angle grain boundary in Cu. PICO 2022, Kasteel Vaalsbroek, The Netherlands (2022)
Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Characterization of the atomic structure of grain boundary phases in pure Cu. Sixth Conference on Frontiers of Aberration Corrected Electron Microscopy PICO 2021, vitual, Kasteel Vaalsbroek, The Netherlands (2021)
Devulapalli, V.; Frommeyer, L.; Ghidelli, M.; Liebscher, C.; Dehm, G.: From epitaxially grown thin films to grain boundary analysis in Cu and Ti. International Workshop on Advanced and In-situ Microscopies of Functional Nanomaterials and Devices, IAMNano, Düsseldorf, Germany (2019)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this ongoing project, we investigate spinodal fluctuations at crystal defects such as grain boundaries and dislocations in Fe-Mn alloys using atom probe tomography, electron microscopy and thermodynamic modeling [1,2].
The aim of the Additive micromanufacturing (AMMicro) project is to fabricate advanced multimaterial/multiphase MEMS devices with superior impact-resistance and self-damage sensing mechanisms.
TiAl-based alloys currently mature into application. Sufficient strength at high temperatures and ductility at ambient temperatures are crucial issues for these novel light-weight materials. By generation of two-phase lamellar TiAl + Ti3Al microstructures, these issues can be successfully solved. Because oxidation resistance at high temperatures is…
We will investigate the electrothermomechanical response of individual metallic nanowires as a function of microstructural interfaces from the growth processes. This will be accomplished using in situ SEM 4-point probe-based electrical resistivity measurements and 2-point probe-based impedance measurements, as a function of mechanical strain and…