Oh, S. H.; Legros, M.; Kiener, D.; Dehm, G.: In situ observation of dislocation nucleation and escape in a submicrometre aluminium single crystal. Nature Materials 8 (2), pp. 95 - 100 (2009)
Kiener, D.; Motz, C.; Dehm, G.; Pippan, R.: Overview on established and novel FIB based miniaturized mechanical testing using in-situ SEM. International Journal of Materials Research 100 (8), pp. 1074 - 1087 (2009)
Yang, B.; Motz, C.; Grosinger, W.; Kammrath, W.; Dehm, G.: Tensile behaviour of micro-sized copper wires studied by a novel fibre tensile module. International Journal of Materials Research 99 (7), pp. 716 - 724 (2008)
Kiener, D.; Grosinger, W.; Dehm, G.; Pippan, R.: A further step towards an understanding of size-dependent crystal plasticity: In situ tenison experiments of miniaturized single-crystal copper samples. Acta Materialia 56 (3), pp. 580 - 592 (2008)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.
This project aims to investigate the dynamic hardness of B2-iron aluminides at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1 and study the microstructure evolution across strain rate range.