Heilmaier, M.; Krüger, M.; Pyczak, F.; Schloffer, M.; Stein, F. (Eds.): Intermetallics 2023. Intermetallics 2023, Bad Staffelstein, Germany, October 02, 2023 - October 06, 2023. Conventus Congressmanagement & Marketing GmbH, Jena, Germany (2023), 122 pp.
Heilmaier, M.; Krüger, M.; Palm, M.; Pyczak, F.; Stein, F. (Eds.): Intermetallics 2021. Intermetallics 2021, Kloster Banz, Bad Staffelstein, Germany, October 04, 2021 - October 08, 2021. Conventus Congressmanagement & Marketing GmbH, Jena, Germany (2021), 208 pp.
Heilmaier, M.; Krüger, M.; Mayer, S.; Palm, M.; Stein, F. (Eds.): Proceedings Intermetallics 2019. Intermetallics 2019, Educational Center Kloster Banz, Bad Staffelstein, Germany, September 30, 2019 - October 04, 2019. Conventus Congressmanagement & Marketing GmbH, Jena, Germany (2019)
Heilmaier, M.; Krüger, M.; Mayer, S.; Palm, M.; Stein, F. (Eds.): Proceedings Intermetallics 2017. Intermetallics 2017, Educational Center Kloster Banz, Bad Staffelstein, Germany, October 02, 2017 - October 06, 2017. Congressmanagement & Marketing GmbH, Jena, Germany (2017), 220 pp.
Heilmaier, M.; Krüger, M.; Mayer, S.; Palm, M.; Stein, F. (Eds.): Proceedings: Intermetallics 2015, International Conference. Intermetallics 2015, International Conference, Bad Staffelstein, Germany, September 28, 2015 - October 02, 2015. Congressmanagement & Marketing GmbH, Jena, Germany (2015), 116 pp.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.