Borodin, S.; Rohwerder, M.: Preparation of model single crystalline aluminium oxide films suitable for scanning tunnelling microscopy. DPG Tagung 2008, 72. Jahrestagung der Deutsche Physikalische Gesellschaft, Berlin, Germany (2008)
Michalik, A.; Rohwerder, M.: Long-range ion transport properties of conducting-polymers. 59th Annual Meeting of the International Society of Electrochemistry, Sevilla, Spain (2008)
Rohwerder, M.: Intelligent corrosion protection by organic coatings based on conducting polymers. Departmental Seminar at Departement für Chemie und Biochemie der Universität Bern, Bern, Switzerland (2008)
Borissov, D.; Rohwerder, M.: Fundamental Investigation of the Effect of Oxides on the Reaction Kinetics During Hot Dip Galvanizing. GALVATECH `07, 7th International Conference on Zinc and Zinc Alloy Coated Steel Sheet, Osaka, Japan (2007)
Isik-Uppenkamp, S.; Laaboudi, A.; Rohwerder, M.: Delamination of Polymer/Metal Interfaces: On the Correlation of Kinetics and Interfacial Structure. 212th ECS Meeting, Washington, D.C., USA (2007)
Borodin, S.; Rohwerder, M.: STM-investigation of self-assembly of phosphonates on model oxides. ECASIA 2007, 12th European Conference on Applications of Surface and Interface Analysis, Brussels-Flggey, Belgium (2007)
Laaboudi, A.; Isik-Uppenkamp, S.; Rohwerder, M.: Modelling cathodic delamination: Oxygen reduction and interface degradation at a molecularly well defined coating/metal interface. ECASIA 2007, 12th European Conference on Applications of Surface and Interface Analysis, Brussels-Flagey, Belgium (2007)
Isik-Uppenkamp, S.; Stratmann, M.; Rohwerder, M.: Scanning Kelvin Probe Microscopy for characterisation of iron mobility at buried interfaces. ECASIA 2007, 12th European Conference on Applications of Surface and Interface Analysis, Brussels-Flggey, Belgium (2007)
Van De Putte, T.; Borissov, D.; Loison, D.; Penning, J.; Rohwerder, M.; Claessens, S.: Reduction of SiO2 Surface Oxides by Solute Carbon to Improve the Galvanizability of Si alloyed AHSS. International Conference on New Developments in Advanced High Strength Sheet Steels, Orlando, FL, USA (2007)
Rohwerder, M.: Inherent delamination protection by novel zinc alloys. GALVATECH `07, 7th International Conference on Zinc and Zinc Alloy Coated Steel Sheet, Osaka, Japan (2007)
Rohwerder, M.: Release-Systeme für die Selbstheilung von Polymer/Metall-Grenzflächen. 2.WING Konferenz (BMBF): Der Stoff, aus dem Innovationen sind., Aachen, Germany (2006)
Stempniewicz, M.; Rohwerder, M.; Marlow, F.: Release of guest molecules from modified mesoporous silica. 5th International Mesostructured Materials Symposium, Shanghai, China (2006)
Michalik, A.; Paliwoda-Porebska, G.; Rohwerder, M.: Mechanism of corrosion protection by conducting polymers. 57th Annual Meeting of the International Society of Electrochemistry, Edinburgh, UK (2006)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…