Cryogenic deformation behavior of an interstitial TRIP high-entropy alloy

Publications of Tobias Schmidt

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Journal Article (1)

1.
Journal Article
Schmidt, T.; Balk, T. J.; Dehm, G.; Arzt, E.: Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia 50 (6), pp. 733 - 737 (2004)
MPG.PuRe
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