Toth, F.; Wiesinger, A.; Cordill, M. J.; Marx, V. M.; Rammerstorfer, F. G.: Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.