Lee, S.; Duarte, M. J.; Liebscher, C.; Oh, S. H.; Dehm, G.: Dislocation Plasticity in Single Crystal FeCrCoMnNi HEA by in-situ TEM Deformation. Schöntal Symposium - Dislocation based plasticity, Schöntal, Germany (2018)
Peter, N. J.; Kirchlechner, C.; Liebscher, C.; Dehm, G.: Effect of the atomistic grain boundary structure on dislocation interaction in copper. Gordon Research Conference (GRC) 2016, Thin Film & Small Scale Mechanical Behavior
, Lewiston, ME, USA (2016)
Meiners, T.; Liebscher, C.; Dehm, G.: Atomic structure and segregation phenomena at copper grain boundaries. EMC2016, The 16th European Microscopy Congress, Lyon, France (2016)
Peter, N. J.; Kirchlechner, C.; Liebscher, C.; Dehm, G.: Beam induced atomic migration at Ag containing nanofacets at an asymmetric Cu grain boundary. European Microscopy Congress (EMC) 2016
, Lyon, France (2016)
Liebscher, C.; Radmilovic, V. R.; Dahmen, U.; Asta, M. D.; Ghosh, G.: Hierarchical Microstructure of Ferritic Superalloys. IAMNano 2015 - The International Workshop on Advance
and In-situ Microscopies of Functional Nanomaterials and
Devices, Hamburg, Germany (2015)
Dehm, G.; Liebscher, C.; Völker, B.; Scheu, C.: Organizer of the “IAMNano 2019 Düsseldorf” - International Workshop on Advanced In Situ Microscopies of Functional Nanomaterials and Devices. (2019)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…