Tsai, S.-P.; Konijnenberg, P. J.; Gonzalez, I.; Hartke, S.; Griffiths, T. A.; Herbig, M.; Kawano-Miyata, K.; Taniyama, A.; Sano, N.; Zaefferer, S.: Development of a new, fully automated system for electron backscatter diffraction (EBSD)-based large volume three-dimensional microstructure mapping using serial sectioning by mechanical polishing, and its application to the analysis of special boundaries in 316L stainless steel. Review of Scientific Instruments 93, 093707 (2022)
Mayweg, D.; Morsdorf, L.; Li, Y.; Herbig, M.: Correlation between grain size and carbon content in white etching areas in bearings. Acta Materialia 215, 117048 (2021)
Herbig, M.; Kumar, A.: Removal of hydrocarbon contamination and oxide films from atom probe specimens. Microscopy Research and Technique 84 (2), pp. 291 - 297 (2021)
Mayweg, D.; Morsdorf, L.; Wu, X.; Herbig, M.: The role of carbon in the white etching crack phenomenon in bearing steels. Acta Materialia 203, 116480 (2021)
Tung, P.-Y.; McEniry, E.; Herbig, M.: The role of electric current in the formation of white-etching-cracks. Philosophical Magazine 101 (1), pp. 59 - 76 (2021)
Morsdorf, L.; Mayweg, D.; Li, Y.; Diederichs, A.; Raabe, D.; Herbig, M.: Moving cracks form white etching areas during rolling contact fatigue in bearings. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 771, 138659 (2020)
Qin, Y.; Li, J.; Herbig, M.: Microstructural origin of the outstanding durability of the high nitrogen bearing steel X30CrMoN15-1. Materials Characterization 159, 110049 (2020)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The goal of this project is the investigation of interplay between the atomic-scale chemistry and the strain rate in affecting the deformation response of Zr-based BMGs. Of special interest are the shear transformation zone nucleation in the elastic regime and the shear band propagation in the plastic regime of BMGs.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.