Publications of Gerhard Dehm

Taylor, A. A.; Cordill, M. J.; Moser, G.; Dehm, G.: A Mechanical Method for Preparing TEM Samples from Brittle Films on Compliant Substrates. Practical Metallography - Praktische Metallographie 48 (8), pp. 408 - 413 (2011)

Cordill, M. J.; Taylor, A. A.; Schalko, J.; Dehm, G.: Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide. International Journal of Materials Research 102 (6), pp. 729 - 734 (2011)

Kiener, D.; Guruprasad, P. J.; Keralavarma, S. M.; Dehm, G.; Benzerga, A. A.: Work hardening in micropillar compression: In situ experiments and modeling. Acta Materialia 59 (10), pp. 3825 - 3840 (2011)

Rester, M.; Fischer, F. D.; Kirchlechner, C.; Schmoelzer, T.; Clemens, H. J.; Dehm, G.: Deformation mechanisms in micron-sized PST TiAl compression samples: Experiment and model. Acta Materialia 59 (9), pp. 3410 - 3421 (2011)

Hou, J.; Zhang, Z.; Preis, W.; Sitte, W.; Dehm, G.: Electrical properties and structure of grain boundaries in n-conducting BaTiO₃ ceramics. Journal of the European Ceramic Society 31 (5), pp. 763 - 771 (2011)

Kirchlechner, C.; Kiener, D.; Motz, C.; Labat, S.; Vaxelaire, N.; Perroud, O.; Micha, J.-S.; Ulrich, O.; Thomas, O.; Dehm, G. et al.; Kečkéš, J.: Dislocation storage in single slip-oriented Cu micro-tensile samples: New insights via X-ray microdiffraction. Philosophical Magazine 91 (7-9), pp. 1256 - 1264 (2011)

Cha, L.; Clemens, H.; Dehm, G.: Microstructure evolution and mechanical properties of an intermetallic Ti–43.5Al–4Nb–1Mo–0.1B alloy after ageing below the eutectoid temperature. International Journal of Materials Research 102 (6), pp. 703 - 708 (2011)

Cazottes, S.; Zhang, Z.; Daniel, R.; Chawla, J. S.; Gall, D.; Dehm, G.: Structural characterization of a Cu/MgO(001) interface using CS-corrected HRTEM. Thin Solid Films 519 (5), pp. 1662 - 1667 (2010)

Heinz, W.; Pippan, R.; Dehm, G.: Investigation of the fatigue behavior of Al thin films with different microstructure. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 527 (29-30), pp. 7757 - 7763 (2010)

Cordill, M. J.; Fischer, F. D.; Rammerstorfer, F. G.; Dehm, G.: Adhesion energies of Cr thin films on polyimide determined from buckling: Experiment and model. Acta Materialia 58 (16), pp. 5520 - 5531 (2010)

Zhang, Z.; Rashkova, B.; Dehm, G.; Lazar, P.; Redinger, J.; Podloucky, R.: Unveiling the atomic and electronic structure of the VN/MgO interface. Physical Review B 82, pp. 060103-1 - 060103-4 (2010)

Matoy, K.; Schönherr, H.; Detzel, T.; Dehm, G.: Micron-sized fracture experiments on amorphous SiO_x films and SiO_x/SiN_x multi-layers. Thin Solid Films 518 (20), pp. 5796 - 5801 (2010)

Rajagopalan, J.; Rentenberger, C.; Karnthaler, H.-P.; Dehm, G.; Saif, M. T. A.: In situ TEM study of microplasticity and Bauschinger effect in nanocrystalline metals. Acta Materialia 58 (14), pp. 4774 - 4782 (2010)

Taylor, A. A.; Oh, S. H.; Dehm, G.; Dehm, G.: Microplasticity phenomena in thermomechanically strained nickel thin films. Journal of Materials Science 45 (14), pp. 3874 - 3881 (2010)

Fischer, F. D.; Cha, L.; Dehm, G.; Clemens, H. J.: Can local hot spots induce α₂/γ lamellae during incomplete massive transformation of γ-TiAl alloys? Intermetallics 18 (5), pp. 972 - 976 (2010)

Huang, R.; Robl, W.; Ceric, H.; Detzel, T.; Dehm, G.: Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions 10 (1), pp. 47 - 54 (2010)

Fischer , F. D.; Waitz, T.; Scheu, C.; Cha, L.; Dehm, G.: Study of nanometer-scaled lamellar microstructure in a Ti–45Al–7.5Nb alloy – Experiments and modeling. Intermetallics 18 (4), pp. 509 - 517 (2010)

Dehm, G.; Wörgötter, H. P.; Cazottes, S.; Purswani, J. M.; Gall, D.; Mitterer, C.; Kiener, D.: Can micro-compression testing provide stress–strain data for thin films? A comparative study using Cu, VN, TiN and W coatings. Thin Solid Films 518 (5), pp. 1517 - 1521 (2009)

Matoy, K.; Detzel, T.; Müller , M.; Motz, C.; Dehm, G.: Interface fracture properties of thin films studied by using the micro-cantilever deflection technique. Surface and Coatings Technology 204 (6-7), pp. 878 - 881 (2009)

Matoy, K.; Schönherr, H.; Detzel, T.; Schöberl, T.; Pippan, R.; Motz, C.; Dehm, G.: A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films. Thin Solid Films 518 (1), pp. 247 - 256 (2009)