Lai, M.; Tasan, C. C.; Zhang, J.; Grabowski, B.; Huang, L.; Springer, H.; Raabe, D.: ω phase accommodated nano-twinning mechanism in Gum Metal: An ab initio study. 3rd International Workshop on Physics Based Material Models and Experimental Observations: Plasticity and Creep, Cesme/Izmir, Turkey (2014)
Springer, H.: A novel roll bonding methodology for the cross-scale analysis of phase properties and interac-tions in multiphase structural materials. MSE 2014, Darmstadt, Germany (2014)
Springer, H.; Kostka, A.: Verbinden von hochfestem Stahl mit einer Aluminiumlegierung durch Rührreibschweißen. 4. GKSS Workshop, Geesthacht, Germany (2009)
Springer, H.: Micromechanics of Materials Design and micromechanics of metal matrix composites and high-throughput mechanical test-ing for alloy design. Lecture: RWTH Aachen, SS 2016, Aachen, Germany, 2016
Springer, H.: Fundamental Research into the Role of Intermetallic Phases in Joining of Aluminium Alloys to Steel. Dissertation, Ruhr-University Bochum, Bochum, Germany (2011)
Max Planck team explains dendrite propagation, paving the way for safer and longer-lasting next-generation batteries. They publish their findings in the journal Nature.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Smaller is stronger” is well known in micromechanics, but the properties far from the quasi-static regime and the nominal temperatures remain unexplored. This research will bridge this gap on how materials behave under the extreme conditions of strain rate and temperature, to enhance fundamental understanding of their deformation mechanisms. The…
In this project, we aim to realize an optimal balance among the strength, ductility and soft magnetic properties in soft-magnetic high-entropy alloys. To this end, we introduce a high-volume fraction of coherent and ordered nanoprecipitates into the high-entropy alloy matrix. The good combination of strength and ductility derives from massive solid…