Hosseinabadi, R.; Riesch-Oppermann, H.; Best, J. P.; Dehm, G.; Kirchlechner, C.: Size-dependent coherent twin boundary strength contribution in Cu micropillars. Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)
Hosseinabadi, R.; Riesch-Oppermann, H.; Best, J. P.; Dehm, G.; Kirchlechner, C.: Size effect in bi-crystalline Cu micropillars with a coherent twin boundary. ECI conference 2022, Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)
Hosseinabadi, R.; Best, J. P.; Kirchlechner, C.; Dehm, G.: Impact of an incoherent twin boundary on the mechanical response of Cu bi-crystalline micropillars. 11th European Solid Mechanics Conference - ESMC 2022, Galway, Ireland (2022)
Hosseinabadi, R.; Dehm, G.; Kirchlechner, C.: Size effect in bi-crystalline Cu micropillars with a coherent twin boundary. DGM Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, online (2020)
Hosseinabadi, R.: Dislocation transmission through coherent and incoherent twin boundaries in copper at the micron scale. Dissertation, Ruhr University Bochum (2024)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project aims to develop a testing methodology for the nano-scale samples inside an SEM using a high-speed nanomechanical low-load sensor (nano-Newton load resolution) and high-speed dark-field differential phase contrast imaging-based scanning transmission electron microscopy (STEM) sensor.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.