Berezkin, A. V.; Kudryavtsev, Y. V.: Effect of Cross-Linking on the Structure and Growth of Polymer Films Prepared by Interfacial Polymerization. Langmuir 31 (44), pp. 12279 - 12290 (2015)
Berezkin, A. V.; Kudryavtsev, Y. V.: Linear interfacial polymerization: Theory and simulations with dissipative particle dynamics. The Journal of Chemical Physics 141 (19), 194906 (2014)
Berezkin, A. V.; Kudryavtsev, Y. V.: Hybrid approach combining dissipative particle dynamics and finite-difference diffusion model: Simulation of reactive polymer coupling and interfacial polymerization. The Journal of Chemical Physics 139 (15), 154102 (2013)
Berezkin, A. V.; Kudryavtsev, Y. V.: End-coupling reactions in incompatible polymer blends: From droplets to complex micelles through interfacial instability. Macromolecules 46 (12), pp. 5080 - 5089 (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.