Malyar, N.; Dehm, G.; Kirchlechner, C.: Strain rate dependence of the slip transfer through a penetrable high angle grain boundary in copper. Scripta Materialia 138, pp. 88 - 91 (2017)
Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions. Acta Materialia 129, pp. 91 - 97 (2017)
Dehm, G.; Malyar, N.; Kirchlechner, C.: Towards probing the barrier strength of grain boundaries for dislocation transmission. Electronic Materials and Applications 2017, Orlando, FL, USA (2017)
Dehm, G.; Malyar, N.; Kirchlechner, C.: Do we understand dislocation transmission through grain boundaries? PICS meeting, Luminy, Marseille, France (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.