Cherevko, S.; Topalov, A. A.; Žeradjanin, A. R.; Mayrhofer, K. J. J.: Coupling of electrochemistry and inductively plasma - Mass spectroscopy: Investigation of the noble metals corrosion. 59th International Conference on Analytical Sciences and Spectroscopy(ICASS)
, Mont-Tremblant, Canada (2013)
Topalov, A. A.; Cherevko, S.; Žeradjanin, A. R.; Mayrhofer, K. J. J.: Stability of Electrocatalyst Materials – A Limiting Factor for the Deployment of Electrochemical Energy Conversion? Third Russian-German Seminar on Catalysis “Bridging the Gap between Model and Real Catalysis. Energy-Related Catalysis”, Burduguz, Lake Baikal, Russia (2013)
Meier, J. C.; Galeano, C.; Katsounaros, I.; Topalov, A. A.; Schüth, F.; Mayrhofer, K. J. J.: Electrode Materials for Electrochemical Energy Conversion. Electrochemistry 2012, Fundamental and Engineering Needs for Sustainable Development, München, Germany (2012)
Topalov, A. A.; Mayrhofer, K. J. J.: Kopplung ICP-MS mit Elektrochemie: Online Untersuchung von Materialkorrosion sowie Stabilität von Brennstoffzellenkatalysatoren. Anorganica 2012, Hilden, Germany (2012)
Cherevko, S.; Topalov, A. A.; Mingers, A.; Mayrhofer, K. J. J.: Effect of Cathodic Polarization on the Electrochemistry of Gold Surfaces. 63rd Annual Meeting of the International Society of Electrochemistry, Prague, Czech Republic (2012)
Cherevko, S.; Topalov, A. A.; Mingers, A. M.; Mayrhofer, K. J. J.: E_ect of Cathodic Polarization on the Electrochemistry of Gold Surfaces. 63rd Annual Meeting of the International Society of Electrochemistry
, Prague, Czech Republic (2012)
Meier, J. C.; Galeano, C.; Katsounaros, I.; Topalov, A. A.; Schüth, F.; Mayrhofer, K. J. J.: Role of Support Interactions for Activity and Stability of Fuel Cell Catalysts. ACS 15th Annual Green Chemistry & Engineering Conference, Washington, D.C., USA (2011)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.