Hieke, S. W.; Breitbach, B.; Dehm, G.; Scheu, C.: Microstructural evolution and solid state dewetting of epitaxial Al thin films on sapphire (α-Al2O3). Acta Materialia 133, pp. 356 - 366 (2017)
Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions. Acta Materialia 129, pp. 91 - 97 (2017)
Peter, N. J.; Liebscher, C.; Kirchlechner, C.; Dehm, G.: Beam-induced atomic migration at Ag-containing nanofacets at an asymmetric Cu grain boundary. Journal of Materials Research 32 (5), pp. 968 - 982 (2017)
Harzer, T. P.; Duarte, M. J.; Dehm, G.: In–situ TEM study of diffusion kinetics and electron irradiation effects on the Cr phase separation of a nanocrystalline Cu–4 at.% Cr thin film alloy. Journal of Alloys and Compounds 695, pp. 1583 - 1590 (2017)
Harzer, T. P.; Dehm, G.: Stability, phase separation and oxidation of a supersaturated nanocrystalline Cu–33 at.% Cr thin film alloy. Thin Solid Films 623, pp. 48 - 58 (2017)
Brinckmann, S.; Kirchlechner, C.; Dehm, G.: Stress intensity factor dependence on anisotropy and geometry during micro-fracture experiments. Scripta Materialia 127, pp. 76 - 78 (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
About 90% of all mechanical service failures are caused by fatigue. Avoiding fatigue failure requires addressing the wide knowledge gap regarding the micromechanical processes governing damage under cyclic loading, which may be fundamentally different from that under static loading. This is particularly true for deformation-induced martensitic…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…