Kanjilal, A.; Aliramaji, S.; Neuß, D.; Hans, M.; Schneider, J. M.; Best, J. P.; Dehm, G.: Microscale deformation of an intermetallic-metal interface in bi-layered film under shear loading. Scripta Materialia 263, 116665 (2025)
Jentner, R.; Scholl, S.; Srivastava, K.; Best, J. P.; Kirchlechner, C.; Dehm, G.: Local strength of bainitic and ferritic HSLA steel constituents understood using correlative electron microscopy and microcompression testing. Materials and Design 236, 112507 (2023)
Jentner, R.; Tsai, S.-P.; Welle, A.; Scholl, S.; Srivastava, K.; Best, J. P.; Kirchlechner, C.; Dehm, G.: Automated classification of granular bainite and polygonal ferrite by electron backscatter diffraction verified through local structural and mechanical analyses. Journal of Materials Research 38 (18), pp. 4177 - 4191 (2023)
Dubosq, R.; Woods, E.; Gault, B.; Best, J. P.: Electron microscope loading and in situ nanoindentation of water ice at cryogenic temperatures. PLoS One 18 (2), e0281703 (2023)
Shi, J.; Ma, S.; Best, J. P.; Stolpe, M.; Wei, S.; Zhang, P.; Markert, B.: Gradient-enhanced modelling of deformation-induced anisotropic damage in metallic glasses. Journal of the Mechanics and Physics of Solids 167, 105020 (2022)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The goal of this project is the investigation of interplay between the atomic-scale chemistry and the strain rate in affecting the deformation response of Zr-based BMGs. Of special interest are the shear transformation zone nucleation in the elastic regime and the shear band propagation in the plastic regime of BMGs.
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.