Wetegrove, M.; Duarte, M. J.; Taube, K.; Rohloff, M.; Gopalan, H.; Scheu, C.; Dehm, G.; Kruth, A.: Preventing Hydrogen Embrittlement: The Role of Barrier Coatings for the Hydrogen Economy, Hydrogen 4 (2 Ed.), pp. 307 - 322 (2023)
Dehm, G.; Liebscher, C.; Völker, B.; Scheu, C.: Organizer of the “IAMNano 2019 Düsseldorf” - International Workshop on Advanced In Situ Microscopies of Functional Nanomaterials and Devices. (2019)
Scheu, C.: Co-organizer of the symposium “PS12 - Materials for Energy Production, Storage and Catalysis” at the “19th International Microscopy Congress. (2018)
Scheu, C.: Co-organizer of the symposium “Experimental and Theoretical insights on Interfaces of Ceramics” at the “Conference on Electronic and Advanced Materials”. (2018)
Hübel, K.; Rohwerder, M.; Scheu, C.; Todorova, M.: Organizer of the workshop “Status and Future Challenges in Characterisation of Interfaces for Electrochemical Applications - Part 1” at the MPIE. (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.