Publications of Tobias Brink

Brink, T.; Langenohl, L.; Pemma, S.; Liebscher, C.; Dehm, G.: Grain boundaries in fcc metals with energetically stable nanofacets. The 11th International Conference on Multiscale Materials Modeling, Prague, Czech Republic (2024)

Bellón Lara, B.; Bhaskar, L.; Sonawane, S.; Brink, T.; Aymerich Armengol, R.; Chatain, D.; Dehm, G.; Ramachandramoorthy, R.: Compression of dewetted Nickel microparticles at ultra-high strain rates. 19th European Mechanics of Materials Conference, Madrid, Spain (2024)

Bhat, M. K.; Brink, T.; Ding, H.; Jung, C.; Best, J. P.; Dehm, G.: Influence of the Structure and Chemistry of Σ5 Grain Boundaries on Microscale Strengthening in Cu Bicrystals. TMS Annual Meeting and Exhibition 2024, Orlando, FL, USA (2024)

Brink, T.: Defect phases and their line defects in fcc metal grain boundaries. DPG-Frühjahrstagung 2024, Berlin, Germany (2024)

Brink, T.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Universality of grain boundary phases in [111] tilt boundaries of fcc metals. TMS 2024 Annual Meeting & Exhibition, Orlando, FL, USA (2024)

Dehm, G.; Langenohl, L.; Ahmad, S.; Ahmadian, A.; Frolov, T.; Duarte, M. J.; Richter, G.; Zhou, X.; Gault, B.; Bishara, H. et al.; Brink, T.; Liebscher, C.: Resolving grain boundary complexions in Copper by STEM and analyzing their impact on properties. Workshop Advanced Electron Microscopy in Materials Research, La Clusaz, France (2023)

Brink, T.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Atomistic Modeling of the Thermodynamics of Grain Boundaries in fcc Metals. 19th International Conference on Diffusion in Solids and Liquids, Crete, Greece (2023)

Brink, T.; Pemma, S.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Complexions in fcc metals: Insights from atomistic simulations. 2nd Materials Science Colloquium, Lech am Arlberg, Austria (2023)

Bellón Lara, B.; Bhaskar, L.; Sonawane, D.; Aymerich Armengol, R.; Brink, T.; Chatain, D.; Dehm, G.; Ramachandramoorthy, R.: Dynamic Cryo-Mechanical Properties of Dewetted Nickel Microparticles. TMS 2023 152nd Annual Meeting and Exhibition, San Diego, CA, USA (2023)

Brink, T.; Bhat, M. K.; Best, J. P.; Dehm, G.: Grain-boundary segregation effects on bicrystal Cu pillar compression. DPG Spring Meeting, Dresden, Germany (2023)

Brink, T.: Atomistic simulations of grain boundary phases: From thermodynamics to mechanics. Seminar Materials Science and Technology at the Ruhr-Universität Bochum , Bochum, Germany (2023)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in pure copper. The 10th International Conference on Multiscale Materials Modeling, Baltimore, MD, USA (2022)

Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)

Brink, T.; Frommeyer, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Grain boundary phase transitions in tilt grain boundaries of fcc metals: Atomistic simulation and experimental evidence. MSE Congress, Darmstadt, Germany (2022)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Liebscher, C.; Dehm, G.: Grain boundary phase transitions and patterning in a copper tilt grain boundary. DPG-Tagung, Regensburg, Germany (2022)

Dehm, G.; Langenohl, L.; Bishara, H.; Brink, T.; Liebscher, C.: Atomic structure and phase stability of Cu tilt grain boundaries resolved by scanning transmission electron microscopy. Materials Science and Engineering MSE Congress, Darmstadt, Germany (2022)

Brink, T.: Thermodynamics of grain boundary phases in fcc metals: Using atomistic simulations to augment and extend experimental insights. Materials Science Colloquium at the Technische Universität Darmstadt, Darmstadt, Germany (2022)

Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic-scale observation of silver segregation in a high angle grain boundary in copper. DPG Tagung, Sektion kondensierte Materie, Regensburg, Germany (accepted)