Peng, Z.; Gault, B.; Raabe, D.: On the Multiple Event Detection in Atom Probe Tomography. Microscopy & Microanalysis 2017 Conference, St. Louis, MO, USA (2017)
Li, Z.; Raabe, D.: Designing novel high-entropy alloys towards superior properties. Frontiers in Materials Processing Applications, Research and Technology (FiMPART'2017), Bordeaux, France (2017)
Liu, C.; Diehl, M.; Shanthraj, P.; Roters, F.; Raabe, D.; Sandlöbes, S.; Dong, J.: An integrated crystal plasticity-phase field approach to locally predict twin formation in magnesium. DGM Meeting, "Herausforderungen bei der skalenübergreifenden Modellierung von Werkstoffen ", Regensburg, Germany (2017)
Roters, F.; Wong, S. L.; Shanthraj, P.; Diehl, M.; Raabe, D.: Thermo mechanically coupled simulation of high manganese TRIP/TWIP Steel. 5th International Conference on Material Modeling, ICMM 5, Rome, Italy (2017)
Raabe, D.; Gault, B.; Yao, M.; Scheu, C.; Liebscher, C.; Herbig, M.: Correlated and simulated electron microscopy and atom probe tomography. Workshop on Possibilities and Limitations of Quantitative Materials Modeling and Characterization 2017, Bernkastel, Germany (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…