Hickel, T.: Introduction to Quantum Mechanics in Solid-State Physics. Lecture: Masterstudiengang „Materials Science and Simulation“, WS 2015/2016, Ruhr-Universität Bochum, Bochum, Germany, October 01, 2015 - March 31, 2016
Hickel, T.: Introduction to Quantum Mechanics in Solid-State Physics. Lecture: Masterstudiengang „Materials Science and Simulation“, WS 2014/2015, Ruhr-Universität Bochum, Bochum, Germany, October 01, 2014 - March 31, 2015
Hickel, T.: Introduction to Quantum Mechanics in Solid-State Physics. Lecture: Masterstudiengang „Materials Science and Simulation“, WS 2013/2014, Ruhr-Universität Bochum, Bochum, Germany, October 01, 2013 - March 31, 2014
Hickel, T.: Introduction to Quantum Mechanics in Solid-State Physics. Lecture: Masterstudiengang „Materials Science and Simulation“, WS 2012/2013, Ruhr-Universität Bochum, Bochum, Germany, October 01, 2012 - March 31, 2013
Hickel, T.: Introduction to Quantum Mechanics in Solid-State Physics. Lecture: Blockveranstaltung, Ruhr-Universität Bochum, Germany, March 21, 2011 - March 25, 2011
Hickel, T.: Introduction to Quantum Mechanics in Solid-State Physics. Lecture: Masterstudiengang „Materials Science and Simulation“, WS 2011/2012, Ruhr-Universität Bochum, Bochum, Germany, October 01, 2011 - March 31, 2012
Neugebauer, J.; Hickel, T.: Moderne Computersimulations-Methoden in der Festkörperphysik. Lecture: Hands-on-Tutorial, Ruhr-Universität Bochum, Bochum, Germany, September 20, 2010 - September 24, 2010
Neugebauer, J.; Hickel, T.: Computerpraktikum: Moderne Computersimulationsmethoden in der Festkörperphysik. Lecture: Blockpraktikum, MPIE, Düsseldorf, Germany, September 20, 2010 - September 24, 2010
Hickel, T.: Moderne Computersimulations-Methoden in der Festkörperphysik. Lecture: Lectures and Exercises, Ruhr-Universität, Bochum, Germany, October 12, 2009 - February 05, 2010
Gomoll, T.: Ab initio Berechnung von Phononenspektren in Systemen mit reduzierter Symmetrie. Diploma, Technische Fachhochschule Berlin, Berlin, Germany (2008)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
Here the focus lies on investigating the temperature dependent fracture of materials down to the individual microstructural length-scales, such as respective phases, grain/phase boundaries or hetero-interfaces, to understand brittle-ductile transitions in deformation and the role of chemistry or crystallography on it.
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.