Hamou, R. F.; Biedermann, P. U.; Rohwerder, M.; Blumenau, A. T.: FEM Simulation of the Scanning Electrochemical Potential Microscopy (SECPM). 2nd IMPRS-SurMat Workshop in Surface and Interface Engineering in Advanced Materials, Ruhr-Universität Bochum, Bochum, Germany (2008)
Salgin, B.; Rohwerder, M.: Effects of the Semiconducting Properties of Surface Oxide on the Delamination at the Polymer/Metal Interface. 2nd International IMPRS-SurMat Workshop, Bochum, Germany (2008)
Mardare, A. I.; Borodin, S.; Rohwerder, M.; Wieck, A. D.; Hassel, A. W.: Gold nanoparticles growth and their embedding in thin anodic alumina. 58th Annual Meeting of the International Society of Electrochemistry, Banff, Canada (2007)
Biedermann, P. U.; Torres, E.; Laaboudi, L.; Isik-Uppenkamp, S.; Rohwerder, M.; Blumenau, A. T.: Cathodic Delamination by a Combined Computational and Experimental Approach: The Aklylthiol/Gold Model System. Multiscale Material Modeling of Condensed Matter, MMM2007, St. Feliu de Guixols, Spain (2007)
Fenster, J. C.; Rohwerder, M.; Hassel, A. W.: Intensity Modulated Photo Electrochemistry of Laser Irradiated Semiconductors. 6th International Symposium on Electrochemical Micro & Nanosystem Technologies, Bonn, Germany (2006)
Park, E.; Hüning, B.; Borodin, S.; Rohwerder, M.; Spiegel, M.: Initial oxidation of Fe-Cr alloys: In situ STM amd ex-situ SEM studies. 6th International Conference on the Microscopy of Oxidation, Birmingham, UK (2005)
Satori, H.; Hassel, A. W.; Rohwerder, M.; Stratmann, M.: Finite Element Simulation of the Cathodic Delamination Process of Coatings on Metal Surfaces. 55th Meeting of the International Society of Electrochemistry, Thessaloniki, Greece (2004)
Paliwoda-Porebska, G.; Michalik, A.; Rohwerder, M.: Conducting polymer coatings for corrosion protection: Pros and cons. Gordon Research Conference on Aqueous Corrosion, New London, NH, USA (2004)
Baumert, B.; Stratmann, M.; Rohwerder, M.: Formability of Ultra-Thin Plasma-Polymer Films Deposited on Metal Sheet: Mesoscopic and Nanoscopic Aspects of Defect Formation. Symposium on Thin Films - Stresses and Mechanical Properties X held at the 2003 MRS Fall Meeting, Boston, MA, USA (2003)
Ehahoun, H.; Stratmann, M.; Rohwerder, M.: Charged Langmuir-Blodgett Films on a metallic Surface: Composition and Structure of the Interface. ISE2002, Düsseldorf, Germany (2002)
van der Kloet, J.; Hassel, A. W.; Rohwerder, M.; Stratmann, M.: Understanding the Role of Copper in FFC on aluminium alloys. 53rd Meeting of the International Society of Electrochemistry, Düsseldorf, Germany (2002)
Hausbrand, R.; Grundmeier, G.; Stratmann, M.; Rohwerder, M.: Design of materials with improved delamination behaviour: The system zinc-magnesium. NH Gordon Conference on Aqueous Corrosion, New London, NH, USA (2002)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…