Tasan, C. C.; Jeannin, O.; Barbier, D.; Morsdorf, L.; Wang, M.; Ponge, D.; Raabe, D.: In-situ characterization of martensite plasticity by high resolution microstructure and microstrain mapping. ICOMAT 2014, International Conference on Martensitic Transformations 2014, Bilbao, Spain (2014)
Wang, M.; Tasan, C. C.; Ponge, D.; Kostka, A.; Raabe, D.: Deformation micro-mechanisms in medium-Mn TRIP-maraging steel. 2nd International Conference on High Manganese Steel, HMnS 2014, Aachen, Germany (2014)
Tasan, C. C.; Wang, M.; Ponge, D.; Kostka, A.; Raabe, D.: Size effects on austenite stability investigated by in-situ EBSD. BSSM 9th Int. Conf. on Advances in Experimental Mechanics, Cardiff, UK (2013)
Wang, M.; Tasan, C. C.; Ponge, D.; Kostka, A.; Raabe, D.: Size effects on mechanical stability of metastable austenite. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The thorough, mechanism-based, quantitative understanding of dislocation-grain boundary interactions is a central aim of the Nano- and Micromechanics group of the MPIE [1-8]. For this purpose, we isolate a single defined grain boundary in micron-sized sample. Subsequently, we measure and compare the uniaxial compression properties with respect to…
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.