Krieg, R.; Vimalanandan, A.; Rohwerder, M.: Corrosion of Zinc and Zn–Mg Alloys with Varying Microstructures and Magnesium Contents. Journal of the Electrochemical Society 161 (3), pp. C156 - C161 (2014)
Krieg, R.; Vimalanandan, A.; Rohwerder, M.; Theirry, D.; Le Bozec, N.: Corrosion Performance of Zinc Magnesium Aluminium Coated steel: Discussion of fundamental mechanisms. 224th ECS Meeting, San Francisco, CA, USA (2013)
Palm, M.; Krieg, R.: Neutral salt spray tests on Fe−Al and Fe−Al−X. FeAl2011, Discussion Meeting on the Development of Innovative Iron Aluminium Alloys, Lanzarote, Canary Islands, Spain (2011)
Krieg, R.: Untersuchungen zur Inhibition der Sauerstoffreduktion durch Zink-basierende Korrosionsproduktschichten. Dissertation, Fakultät für Chemie und Biochemie, Ruhr-Universität Bochum, Bochum, Germany (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The thorough, mechanism-based, quantitative understanding of dislocation-grain boundary interactions is a central aim of the Nano- and Micromechanics group of the MPIE [1-8]. For this purpose, we isolate a single defined grain boundary in micron-sized sample. Subsequently, we measure and compare the uniaxial compression properties with respect to…
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.