Wang, Z.; Gu, J.; An, D.; Liu, Y.; Song, M.: Characterization of the microstructure and deformation substructure evolution in a hierarchal high-entropy alloy by correlative EBSD and ECCI. Intermetallics 121, 106788 (2020)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.