Publications of Gerhard Dehm

Dehm, G.; Oh, S. H.; Gruber, P. A.; Legros, M.; Fischer, F. D.: Strain compensation by twinning in Au thin films: Experiment and model. Acta Materialia 55 (19), pp. 6659 - 6665 (2007)

Kiener, D.; Rester, M.; Scheriau, S.; Yang, B.; Pippan, R.; Dehm, G.: Influence of external and internal length scale on the flow stress of copper. International Journal of Materials Research 98 (11), pp. 1047 - 1053 (2007)

Inkson, B. J.; Dehm, G.; Peng, Y.: Dynamical growth of Cu-Pt nanowires with a nanonecklace morphology. Nanotechnology 18 (41), 415601, pp. 1 - 5 (2007)

Oh, S. H.; Legros, M.; Kiener, D.; Gruber, P. A.; Dehm, G.: In situ TEM straining of single crystal Au films on polyimide: Change of deformation mechanisms at the nanoscale. Acta Materialia 55 (16), pp. 5558 - 5571 (2007)

Kiener, D.; Motz, C.; Rester, M.; Jenko, M.; Dehm, G.: FIB damage of Cu and possible consequences for miniaturized mechanical tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 459 (1-2), pp. 262 - 272 (2007)

Eiper, E.; Kečkéš, J.; Martinschitz, K. J.; Zizak, I.; Cabié, M.; Dehm, G.: Size-independent stresses in Al thin films thermally strained down to -100°C. Acta Materialia 55 (6), pp. 1941 - 1946 (2007)

Clemens, H. J.; Bartels, A.; Bystrzanowski, S.; Chladil, H. F.; Leitner, H.; Dehm, G.; Gerling, R. W.; Schimansky, F. P.: Grain refinement in γ-Ti–Al-based alloys by solid state phase transformations. Intermetallics 14 (12), pp. 1380 - 1385 (2006)

Kiener, D.; Motz, C.; Schöberl, T.; Jenko, M.; Dehm, G.: Determination of mechanical properties of copper at the micron scale. Advanced Engineering Materials 8 (11), pp. 1119 - 1125 (2006)

Dehm, G.; Motz, C.; Scheu, C.; Clemens, H. J.; Mayrhofer, P. H.; Mitterer, C.: Mechanical size-effects in miniaturized and bulk materials. Advanced Engineering Materials 8 (11), pp. 1033 - 1045 (2006)

Kečkéš, J.; Eiper, E.; Martinschitz, K. J.; Boesecke, P.; Gindl, W.; Dehm, G.: In situ X-ray Diffraction as a tool to probe mechanical phenomena down to the nano-scale. Advanced Engineering Materials 8 (11), pp. 1084 - 1088 (2006)

Sonnweber-Ribic, P.; Gruber, P.; Dehm, G.; Arzt, E.: Texture transition in Cu thin films: electron backscatter diffraction vs. X-ray diffraction. Acta Materialia 54 (15), pp. 3863 - 3870 (2006)

Scheu, C.; Gao, M.; Oh, S. H.; Dehm, G.; Klein, S.; Tomsia, A.; Rühle, M.: Bonding at copper-alumina interfaces established by different surface treatments: a critical review. Journal of Materials Science 41 (16), pp. 5161 - 5168 (2006)

Riethmüller, J.; Dehm, G.; Affeldt, E. E.; Arzt, E.: Microstructure and mechanical behavior of Pt-modified NiAl diffusion coatings. International Journal of Materials Research 97 (6), pp. 689 - 698 (2006)

Wetscher, F.; Pippan, R.; Šturm, S.; Kauffmann, F.; Scheu, C.; Dehm, G.: TEM investigation of the structural evolution in a pearlitic steel deformed by high pressure torsion. Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science 37 (6), pp. 1963 - 1968 (2006)

Legros, M.; Kaouache, B.; Gergaud, P.; Thomas, O.; Dehm, G.; Balk, T. J.; Arzt, E.: Pipe-diffusion ripening of Si precipitates in Al-0.5% Cu-1%Si thin films. Philosophical Magazine 85 (30), pp. 3541 - 3552 (2005)

Cohen, S. S.; Goren-Muginstein, G. R.; Avraham, S.; Rashkova, B.; Dehm, G.; Bamberger, M. S.: Precipitation hardening in Mg–Zn–Sn alloys with minor additions of Ca and Si. Zeitschrift für Metallkunde 96 (9), pp. 1081 - 1087 (2005)

Girgsdies, F.; Ressler, T.; Wild, U.; Wübben, T.; Balk, T. J.; Dehm, G.; Zhou, L.; Günther, S.; Arzt, E.; Imbihl, R. et al.; Schlögl, R.: Strained thin copper films as model catalysts in the materials gap. Catalysis Letters 102 (1-2), pp. 91 - 97 (2005)

Kauffmann, F.; Ji, B.; Dehm, G.; Gao, H.; Arzt, E.: A quantitative study of the hardness in a superhard nanocrystalline titanium nitride/silicon nitride coating. Scripta Materialia 52 (12), pp. 1269 - 1274 (2005)

Bystrzanowski, S.; Bartels, A.; Clemens, H.; Gerling, R. W.; Schimansky, F. P.; Dehm, G.; Kestler, H.: Creep behaviour and related high temperature microstructural stability of Ti-46Al-9Nb sheet material. Intermetallics 13 (5), pp. 515 - 524 (2005)

Dehm, G.; Edongué, H.; Wagner, T. A.; Oh, S. H.; Arzt, E.: Obtaining different orientation relationships for Cu films grown on (0001) α-Al₂O₃ substrates by magnetron sputtering. Zeitschrift für Metallkunde 96 (3), pp. 249 - 254 (2005)