Abu-Farsakh, H.; Neugebauer, J.: Enhancing nitrogen solubility in GaAs and InAs by surface kinetics: An ab initio study. Physical Review B 79, 155311, pp. 155311 - 155323 (2009)
Abu-Farsakh, H.; Neugebauer, J.: Exploring the unusual diffusion of N adatoms on GaAs(001) using first principles calculations. DPG Frühjahrstagung 2010, Regensburg, Germany (2010)
Abu-Farsakh, H.; Neugebauer, J.: Exploring the unusual diffusion of N adatoms at GaAs(001) surface. Computational Materials Science on Complex Energy Landscapes Workshop, Imst, Austria (2010)
Abu-Farsakh, H.; Neugebauer, J.: Enhancing N solubility in diluted nitrides by surface kinetics: An ab-initio study. Spring meeting of the German Physical Society (DPG), Berlin, Germany (2008)
Abu-Farsakh, H.; Neugebauer, J.: Ab-initio study of the thermodynamics and kinetics of N at GaAs(001) surface. PAW workshop 2007, Goslar, Germany (2007)
Abu-Farsakh, H.; Neugebauer, J.: In-N anti-correlation in InGaAsN alloys: The delicate interplay between adatom thermodynamics and kinetics. Spring meeting of the German Physical Society (DPG), Regensburg, Germany (2007)
Abu-Farsakh, H.; Neugebauer, J.: Tailoring the N-solubility in InGaAs-alloys by surface engineering: Applications and limits. 1. Harzer Ab initio Workshop, Clausthal, Germany (2006)
Abu-Farsakh, H.; Neugebauer, J.: Incorporation of N at GaAs and InAs surfaces: An ab-initio study. Technische Universität Berlin, Berlin, Germany (2006)
Abu-Farsakh, H.; Dick, A.; Neugebauer, J.: Incorporation of N at GaAs and InAs surfaces. Deutsche Physikalische Gesellschaft Spring Meeting of the Division Condensed Matter, Dresden, Germany (2006)
Abu-Farsakh, H.; Neugebauer, J.: Combined ab-initio and Monte Carlo calculations to explore the surface thermodynamics and kinetics of dilute nitrides. 8th International Conference on Nitride Semiconductors (ICNS-8), Jeju Island, South Korea (2009)
Abu-Farsakh, H.; Neugebauer, J.: The role of surface kinetics in achieving high non-equilibrium N concentrations in bulk GaAs. DPG Spring Meeting 2009, Dresden, Germany (2009)
Abu-Farsakh, H.; Neugebauer, J.; Albrecht, M.: Ab-initio study of compositional anti-correlation of In and N in InGaAsN alloys. The 7th International Conference of Nitride Semiconductors (ICNS-7), Las Vegas, NV, USA (2007)
Abu-Farsakh, H.; Neugebauer, J.: Enhancing the solubility of N in GaAs and InAs by surface kinetics. 28th International Conference on the Physics of Semiconductors, Vienna, Austria (2006)
Abu-Farsakh, H.; Neugebauer, J.: Enhancing bulk solubility by surface engineering: An ab-initio study. Workshop: Ab initio Description of Iron and Steel, Status and future challenges, Ringberg Castle, Germany (2006)
Abu-Farsakh, H.: Understanding the interplay between thermodynamics and surface kinetics in the growth of dilute nitride alloys from first principles. Dissertation, University of Paderborn, Paderborn, Germany (2010)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…