Berezkin, A. V.; Kudryavtsev, Y. V.: Effect of Cross-Linking on the Structure and Growth of Polymer Films Prepared by Interfacial Polymerization. Langmuir 31 (44), pp. 12279 - 12290 (2015)
Berezkin, A. V.; Kudryavtsev, Y. V.: Linear interfacial polymerization: Theory and simulations with dissipative particle dynamics. The Journal of Chemical Physics 141 (19), 194906 (2014)
Berezkin, A. V.; Kudryavtsev, Y. V.: Hybrid approach combining dissipative particle dynamics and finite-difference diffusion model: Simulation of reactive polymer coupling and interfacial polymerization. The Journal of Chemical Physics 139 (15), 154102 (2013)
Berezkin, A. V.; Kudryavtsev, Y. V.: End-coupling reactions in incompatible polymer blends: From droplets to complex micelles through interfacial instability. Macromolecules 46 (12), pp. 5080 - 5089 (2013)
Auer, A. A.; Richter, A.; Berezkin, A. V.; Guseva, D. V.; Spange, S.: Theoretical study of twin polymerization – From chemical reactivity to structure formation. Macromolecular Theory Simulations 21 (9), pp. 615 - 628 (2012)
Berezkin, A. V.; Biedermann, P. U.: Multiscale simulation of polyurethane network. World Polymer Congress 2012, Blacksburg, Virginia Tech, USA, June 24, 2012 - June 29, 2012. (2012)
Berezkin, A. V.; Biedermann, P. U.; Auer, A. A.: Mesoscale simulation of network formation and structure, combining molecular dynamics and kinetic Monte Carlo approaches. European Polymer Congress 2011, Granada, Spain, June 26, 2011 - July 01, 2011. (2011)
Berezkin, A. V.; Biedermann, P. U.; Auer, A. A.: Mesoscale simulation of network formation and structure, combining molecular dynamics and kinetic Monte Carlo approaches. European Polymer Congress 2011, Granada, Spain (2011)
Berezkin, A. V.; Biedermann, P. U.: Simulation of polyurethane and water interac-tions with the ZnO surface: DFT and classical OPLS-AA force field calculation. 4-th World Congress on Adhesion and Related Phenomena, Arcachon, France 2010 (2010)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…