Smith, A. J.; Milenkovic, S.; Hassel, A. W.: Initial steps in handling single nanowires. 92. AGEF-Seminar DFG-SPP 1165 „Elektrochemische Aspekte von Nanodrähten und Nanoröhren“, Düsseldorf, Germany (2007)
Smith, A. J.; Milenkovic, S.; Hassel, A. W.: Directionally Solidfied Nanostructured Materials: Properties and Applications. International Bunsen Discussion Meeting: Modern electrochemistry of new materials, Rathen, Germany (2006)
Smith, A. J.; Stratmann, M.; Hassel, A. W.: Studying Passive Materials under Erosion-Corrosion Conditions using Single Particle Impingement Experiments. 56rd Meeting of the International Society of Electrochemistry, Edingburgh, UK (2006)
Ein-Eli, Y.; Abelev, E.; Smith, A. J.; Hassel, A. W.: Studies on Copper Repassivation Characteristics in Basic Solutions Another Step towards a “Traditional” CMP. 6th International Symposium on Electrochemical Micro & Nanosystem Technologies, Bonn, Germany (2006)
Smith, A. J.; Milenkovic, S.; Hassel, A. W.: Metallic Nanoarrays for application in Nanoelectronics and Nanosensor Technology. 4th Spring meeting of the International Society of Electrochemistry, Singapur, Singapur (2006)
Hassel, A. W.; Smith, A. J.; Stratmann, M.: Schnelle Transientenmessungen zur Detektion von Einzelpartikeltreffern. Bunsenkolloquium „Elektrochemie von tiefsten zu höchsten Temperaturen und von kleinsten zu größten Strömen“, Dresden, Germany (2005)
Fenster, J. C.; Smith, A. J.; Hassel, A. W.: Single Oxidized Tungsten Nanowires as Ion Selective Probes. 7th International Symposium on Electrochemical Micro- and Nanosystems, Ein-Gedi, Israel (2008)
Milenkovic, S.; Frankel, D.; Smith, A. J.; Hassel, A. W.: Selective Phase Dissolution of NiAl-Mo Directionally Solidified Eutectic Alloys. 7th International Symposium on Electrochemical Micro- and Nanosystems, Ein-Gedi, Israel (2008)
Fenster, J. C.; Smith, A. J.; Hassel, A. W.: Tungsten nanowires for the measurement of the pH value in confined zones. Bunsentagung 2008, Saarbrücken, Germany (2008)
Brittmann, S.; Smith, A. J.; Hassel, A. W.: Electrochemical Treatment of Silver-Copper and Lead Silver Directionally Solidified Eutectic Alloys for the Fabrication of Nanowires. 6th International Symposium on Electrochemical Micro & Nanosystem Technologies, Bonn, Germany (2006)
Smith, A. J.; Hassel, A. W.: Studying and Applying Metallic Nanowires Obtained from Electrochemical Treatment of Directionally Solidified Eutectics. 6th International Symposium on Electrochemical Micro & Nanosystem Technologies, Bonn, Germany (2006)
Smith, A. J.; Hassel, A. W.; Stratmann, M.: In-situ Untersuchungen zur Winkelabhängigkeit von Einzelpartikeltreffern in der Partikelinduzierten Strömungskorrosion. GDCh, Jahrestagung 2005, Fachgruppe Angewandte Elektrochemie, Düsseldorf, Germany (2005)
Smith, A. J.; Tan, K. S.; Stratmann, M.; Hassel, A. W.: Korrelation von “Jet impingement” und Mikroindentation Versuchen. 79. AGEF Seminar - 25 Jahre Elektrochemie in Düsseldorf, Düsseldorf, Germany (2004)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…