Marx, V. M.; Cordill, M. J.; Kirchlechner, C.; Dehm, G.: In-situ stress measurements in thin films using synchrotron diffraction. Summer School: Theory and Practice of Modern Powder Diffraction, Tagungshaus Schönenberg, Ellwangen, Ellwangen, Germany (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Design and development of fracture property measurement techniques at the small scale. ICAMS (RUB), Bochum, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Berger, J.; Cordill, M. J.; Dehm, G.: In-situ stress measurements in Cu films using synchrotron radiation. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)
Dehm, G.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. Schöntal Symposium - Dislocation-based Plasticity, Kloster Schöntal, Germany (2014)
Dehm, G.; Imrich, P. J.; Wimmer, A. C.; Kirchlechner, C.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. TMS2014, 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Clamped beam geometry for fracture toughness testing of (Pt,Ni)Al bond coats at the micron-scale. AK- Rasterkraftmikroskopie und Nanomechanische Methoden, Düsseldorf, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Effects of the film thickness on the deformation behavior of thin Cu films on polyimide. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, Max-Planck-Institut für Eisenforschung GmbH, Düsseldorf, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Film thickness effects on the deformation behavior of Cu/Cr thin films on polyimide. TMS 2014: 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Dehm, G.: Shedding light on the role of interfaces for strengthening materials by using micromechanical testing. 60. Metallkunde-Jubiläumskolloquium, Lech am Arlberg, Germany (2014)
Dehm, G.: Cu–Cr nanocomposites and multilayers. Gordon Research Conference: Thin Film & Small Scale Mechanical Behavior, Bentley University, Boston, MA, USA (2014)
Dehm, G.: Localized mechanical study of individual interfaces in miniaturized Cu structures. MS&T14 - Materials Science & Technology 2014, Pittsburgh, PA, USA (2014)
Imrich, P. J.; Kirchlechner, C.; Motz, C.; Jeon, J. B.; Dehm, G.: In Situ Electron Microscopy and Micro-Laue Study of Plasticity in Miniaturized Cu Bicrystals. CAMTEC III, Symposium on Fine-Scale Mechanical Characterisation and Behaviour , Cambridge, UK (2014)
Kirchlechner, C.; Imrich, P. J.; Motz, C.; Dehm, G.: Plastic deformation of bi-crystalline micro pillars analyzed by in situ µLaue diffraction. TMS2014, Annual Meeting & Exhibition, San Diego, CA, USA (2014)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we study the development of a maraging steel alloy consisting of Fe, Ni and Al, that shows pronounced response to the intrinsic heat treatment imposed during Laser Additive Manufacturing (LAM). Without any further heat treatment, it was possible to produce a maraging steel that is intrinsically precipitation strengthened by an…
The aim of the current study is to investigate electrochemical corrosion mechanisms by examining the metal-liquid nanointerfaces. To achieve this, corrosive fluids will be strategically trapped within metal structures using novel additive micro fabrication techniques. Subsequently, the nanointerfaces will be analyzed using cryo-atom probe…
Deviations from the ideal, stoichiometric composition of tcp (tetrahedrally close-packed) intermetallic phases as, e.g., Laves phases can be partially compensated by point defects like antisite atoms or vacancies, but also planar defects may offer an opportunity to accommodate excess atoms.
We plan to investigate the rate-dependent tensile properties of 2D materials such as metal thin films and PbMoO4 (PMO) films by using a combination of a novel plan-view FIB based sample lift out method and a MEMS based in situ tensile testing platform inside a TEM.