Schneider, P.; Sigel, R.; Lange, M. M.; Beier, F.; Renner, F. U.; Erbe, A.: Activation and fluoride-assisted phosphating of aluminium silicon coated steel. ACS Applied Materials and Interfaces 5 (10), pp. 4224 - 4232 (2013)
Kawano, T.; Renner, F. U.: Studies on Wetting Behaviour of Hot-dip Galvanizing Process by use of Model Specimens with Tailored Surface Oxides. Surf. Int. Anal. 44 (8), pp. 1009 - 1012 (2012)
Kawano, T.; Renner, F. U.: Tailoring Model Surface and Wetting Experiment for a Fundamental Understanding of Hot-dip Galvanizing. ISIJ International 51, 10, pp. 1703 - 1709 (2011)
Valtiner, M.; Ankah, G. N.; Bashir, A.; Renner, F. U.: Atomic force microscope imaging and force measurements at electrified and actively corroding interfaces: Challenges and novel cell design. Review of Scientific Instruments 82 (2), pp. 023703-1 - 023703-8 (2011)
Naraparaju, R.; Christ, H.-J.; Renner, F. U.; Kostka, A.: Effect of shot-peening on the oxidation behaviour of boiler steels. Oxidation of Metals 76 (3-4), pp. 233 - 245 (2011)
Borissov, D.; Pareek, A.; Renner, F. U.; Rohwerder, M.: Electrodeposition of Zn and Au–Zn alloys at low temperature in an ionic liquid. Physical Chemistry Chemical Physics 12 (9), pp. 2059 - 2062 (2010)
Gründer, Y.; Renner, F. U.; Lee,, T. L.: The electrodeposition of copper onto UHV-prepared GaAs(001) surfaces. Surface Science 603 (17), pp. L105 - L108 (2009)
Naraparaju, R.; Christ, H.-J.; Renner, F. U.; Kostka, A.: Dislocation Engineering and its effect on the oxidation behaviour. Materials at High Temperatures 29, pp. 116 - 122 (2012)
Duarte, M. J.; Brinckmann, S.; Renner, F. U.; Dehm, G.: Nanomechanical testing under environmental conditins of Fe-based metallic glasses. 22st International Symposium on Metastable Amorphous and Nanostructured Materials, ISMANAM 2015, Paris, France (2015)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…