Schmidt, T.; Balk, T. J.; Dehm, G.; Arzt, E.: Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia 50 (6), pp. 733 - 737 (2004)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project endeavours to offer comprehensive insights into GB phases and their mechanical responses within both pure Ni and Ni-X (X=Cu, Au, Nb) solid solutions. The outcomes of this research will contribute to the development of mechanism-property diagrams, guiding material design and optimization strategies for various applications.