Frank, A.; Dias, M.; Hieke, S. W.; Kruth, A.; Scheu, C.: Spontaneous fluctuations in a plasma ion assisted deposition – correlation between deposition conditions and vanadium oxide thin film growth. Thin Solid Films 722, 138574 (2021)
Frank, A.; Wochnik, A. S.; Bein, T.; Scheu, C.: A biomolecule-assisted, cost-efficient route for growing tunable CuInS2 films for green energy application. RSC Advances 7 (33), pp. 20219 - 20230 (2017)
Hettstedt, C.; Frank, A.; Karaghiosoff, K.: Synthesis of two p-methoxyphenyl substituted phosphines. Phosphorus, Sulfur, and Silicon and the Related Elements 191 (10), pp. 1297 - 1301 (2016)
Frank, A.; Changizi, R.; Scheu, C.: Preparative and analytical challenges in electron microscopic investigation of nanostructured CuInS2 thin films for energy applications. Microscience Microscopy Congress (MMC) 2019, Manchester, UK (2019)
Gänsler, T.; Frank, A.; Betzler, S. B.; Scheu, C.: Electron microscopy studies of Nb3O7(OH) nanostructured cubes - insights in the growth mechanism. Microscience Microscopy Congress MMC2019, Manchester, UK (2019)
Frank, A.; Dias, M.; Hieke, S. W.; Kruth, A.; Scheu, C.: Electron microscopic investigation of the influence of plasma parameters on VOx films deposited by a plasma ion assisted process. E-MRS 2019 Spring Meeting, Nice, France (2019)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
We plan to investigate the rate-dependent tensile properties of 2D materials such as HCP metal thin films and PbMoO4 (PMO) films by using a combination of a novel plan-view FIB based sample lift out method and a MEMS based in situ tensile testing platform inside a TEM.