Welsch, E. D.; Haghighat, S. M. H.; Gutiérrez-Urrutia, I.; Raabe, D.: Investigation of nano-sized kappa carbide distribution in advanced austenitic lightweight high-Mn steels by coupled TEM and DDD simulations: Strengthening and dislocation-based mechanisms. 2nd International Conference on High Manganese Steels, Aachen, Germany (2014)
Haghighat, S. M. H.; Eggeler, G. F.; Raabe, D.: Mesoscale modelling of the influence of loading conditions on the dislocation mobility and creep process in single crystal Ni base superalloys. KTH Stockholm-Sweden, Stockholm, Sweden (2014)
Haghighat, S. M. H.; Eggeler, G.; Raabe, D.: Discrete Dislocation Dynamics Study of Creep Anisotropy in Single Crystal Ni Base Superalloys. MRS Fall Meeting, Bosten, USA (2013)
Haghighat, S. M. H.; Schäublin, R.; Raabe, D.: Molecular Dynamics Study of Obstacle Induced Hardening; From Nano-Sized Defects to Binary Junction. MRS Fall Meeting, Bosten, MA, USA (2013)
Haghighat, S. M. H.; Schäublin, R.; Raabe, D.: Atomistic study of forest hardening through binary dislocation junction in bcc-iron. 2013 MRS Spring Meeting, San Francisco, CA, USA (2013)
Haghighat, S. M. H.; Eggeler, G.; Raabe, D.: Discrete dislocation dynamics modeling of loading orientation effect on the low stress creep of single crystal Ni base superalloys. Intermetallics 2013, Bad Staffelstein, Germany (2013)
Haghighat, S. M. H.; Eggeler, G.; Raabe, D.: Primary creep of Ni base supealloys used in hot gas turbine blades. Alstom Company, Baden, Switzerland (2012)
Haghighat, S. M. H.; Eggeler, G.; Raabe, D.: Dislocation dynamics modeling of the glide-climb mobility of a ½ a0<110>{111} dislocation in interaction with γ’ precipitate in Ni-based superalloy. 4th International Conference on Dislocations, Budapest, Hungary (2012)
Haghighat, S. M. H.; Schäublin, R.: Perspective of multiscale simulation approach in the development of novel materials. Tarbiat Modares University, Tehran, Iran (2012)
Haghighat, S. M. H.; Schäublin, R.: Atomistic simulation and transmission electron microscopy of obstacle strengthening in iron. Sahand University of Technology, Tabri, Iran (2012)
Haghighat, S. M. H.; von Pezold, J.; Neugebauer, J.; Raabe, D.: Effect of local stress state on the glide of ½a₀<111> screw dislocation in bcc-Fe. 1st Austrian-German Workshop on Computational Materials Design, Kramsach, Austria (2012)
Schäublin, J.; Haghighat, S. M. H.: Simulation of the screw dislocation mobility in Fe by molecular dynamics. E-MRS Spring Meeting, Nice, France (2011)
Haghighat, S. M. H.; Schäublin, R.: Dislocations mechanisms in bcc-Fe; from atomistic to TEM observation. Workshop on ab initio Description of Iron and Steel: Mechanical properties, Ringberg Castle, Germany (2010)
Haghighat, S. M. H.; Reed, R. C.; Raabe, D.: Modeling of dislocation mechanisms and the influence of the γ/γ´lattice misfit on the dislocation assisted creep of high temperature Ni-base superalloys. 7th International Conference on Multiscale Materials Modeling , Berkeley, CA, USA (2014)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…