Haghighat, S. M. H.; Eggeler, G. F.; Raabe, D.: Mesoscale modelling of the influence of loading conditions on the dislocation mobility and creep process in single crystal Ni base superalloys. KTH Stockholm-Sweden, Stockholm, Sweden (2014)
Neelakantan, L.; Eggeler, G. F.; Hassel, A. W.: Investigations to understand the mechanisms during electropolishing of NiTi. 6th International Symposium on Electrochemical Micro & Nanosystem Technologies, Bonn, Germany (2006)
Neelakantan, L.; Eggeler, G. F.; Hassel, A. W.: Electropolishing of NiTi - Insight its mechanism. 58th Annual Meeting of the International Society of Electrochemistry, Banff, Canada (2007)
Hariharan, A.: On the interfacial defect formation mechanism during laser additive manufac-turing of polycrystalline superalloys. Dissertation, Ruhr-Universität Bochum (2019)
Hariharan, A.: On the interfacial defect formation mechanism during laser additive manufacturing of polycrystalline superalloys. Dissertation, Ruhr-Universität Bochum (2019)
Luo, W.: Mechanical properties of the cubic and hexagonal NbCo2 Laves phases studied by micromechanical testing. Dissertation, Ruhr-Universität Bochum (2019)
Wu , X.: Elementary deformation processes during low temperature and high stress creep of Ni-base single crystal superalloys. Dissertation, Ruhr-University Bochum, Bochum, Germany (2016)
Aghajani, A.: Evolution of microstructure during long-term creep of a tempered martensite ferritic steel. Dissertation, Ruhr-University Bochum, Bochum (2009)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.