Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)
Harzer, T. P.; Dehm, G.: Microstructural studies of Cu–Cr thin film structures grown by molecular beam epitaxy using advanced transmission electron microscopy. Macan Theromodynamics Workshop, Istanbul, Turkey (2012)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
Eiper, E.; Martinschitz, K. J.; Dehm, G.; Kečkéš, J.: Size effect in metallic thin films characterized by low-temperature X-ray diffraction. Gordon Research Conference on thin film & smallscale mechanical behavior , Colby College Waterville, Maine, USA (2006)
Rester, M.; Kiener, D.; Kreuzer, H. G.M.; Dehm, G.; Motz, C.: Microstructural investigation of the deformation zone below nanoindents in copper, silver and nickel. Hysitron Workshop and Usermeeting, München, Germany (2006)
Max Planck scientists design a process that merges metal extraction, alloying and processing into one single, eco-friendly step. Their results are now published in the journal Nature.
Scientists of the Max-Planck-Institut für Eisenforschung pioneer new machine learning model for corrosion-resistant alloy design. Their results are now published in the journal Science Advances
Developing and providing accurate simulation techniques to explore and predict structural properties and chemical reactions at electrified surfaces and interfaces is critical to surmount materials-related challenges in the context of sustainability, energy conversion and storage. The groups of C. Freysoldt, M. Todorova and S. Wippermann develop…
ECCI is an imaging technique in scanning electron microscopy based on electron channelling applying a backscatter electron detector. It is used for direct observation of lattice defects, for example dislocations or stacking faults, close to the surface of bulk samples.
We will investigate the electrothermomechanical response of individual metallic nanowires as a function of microstructural interfaces from the growth processes. This will be accomplished using in situ SEM 4-point probe-based electrical resistivity measurements and 2-point probe-based impedance measurements, as a function of mechanical strain and…
The utilization of Kelvin Probe (KP) techniques for spatially resolved high sensitivity measurement of hydrogen has been a major break-through for our work on hydrogen in materials. A relatively straight forward approach was hydrogen mapping for supporting research on hydrogen embrittlement that was successfully applied on different materials, and…
This project will aim at developing MEMS based nanoforce sensors with capacitive sensing capabilities. The nanoforce sensors will be further incorporated with in situ SEM and TEM small scale testing systems, for allowing simultaneous visualization of the deformation process during mechanical tests