![© G. Geelen, Max-Planck-Institut für Eisenforschung GmbH © G. Geelen, Max-Planck-Institut für Eisenforschung GmbH](/3026379/header_image-1699523275.jpg?t=eyJ3aWR0aCI6ODQ4LCJmaWxlX2V4dGVuc2lvbiI6ImpwZyIsIm9ial9pZCI6MzAyNjM3OX0%3D--502883a40345a4cae66f5ca0414162166c5b8e24)
Publications of Michael Reisinger
All genres
Journal Article (1)
1.
Journal Article
8, 100503 (2019)
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia Talk (1)
2.
Talk
Ni–P: Microstructure and micro-compression. Nanomechanical Testing in Materials Research and Development VII
, Malaga, Spain (2019)