Sharma, V. M.; Svetlizky, D.; Das, M.; Tevet, O.; Krämer, M.; Kim, S.-H.; Gault, B.; Eliaz, N.: Microstructure and mechanical properties of bulk NiTi shape memory alloy fabricated using directed energy deposition. Additive Manufacturing 86, 104224 (2024)
Krämer, M.; Favelukis, B.; El-Zoka, A.; Sokol, M.; Rosen, B. A.; Eliaz, N.; Kim, S.-H.; Gault, B.: Near-Atomic Scale Perspective on the Oxidation of Ti3C2Tx MXenes: Insights from Atom Probe Tomography. Advanced Materials 23, 2305183 (2024)
Krämer, M.; Favelukis, B.; El-Zoka, A.; Sokol, M.; A. Rosen, B.; Eliaz, N.; Kim, S.-H.; Gault, B.: Compositional mapping of 2D MXenes at the near-atomic-scale by atom probe tomography. EUROMXENE Congress 2024, Valencia, Spain (2024)
Krämer, M.; Favelukis, B.; Sokol, M.; Rosen, B. A.; Eliaz, N.; Kim, S.-H.; Gault, B.: Facilitating Atom Probe Tomography of Free-Standing 2D MXene Films. Atom Probe Tomography & Microscopy (APT&M) 2023, Leuven, Belgium (2023)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…