Herbig, M.; Choi, P.; Raabe, D.: Combining Structural and Chemical Information on the nm Scale by Correlative TEM and APT Characterization. Euromat 2013, Sevilla, Spain (2013)
Gutiérrez-Urrutia, I.; Seol, J.-B.; Marceau, R. K. W.; Choi, P.; Raabe, D.: Multi-scale characterization of advanced structural steels: from the micro to the atomic-scale. 8th Pacific Rim International Congress on Advanced Materials and Processing (PRICM-8), Waikoloa, Hawai, USA (2013)
Herbig, M.; Choi, P.; Raabe, D.: Combining Structural and Chemical Information on the nm Scale by Correlative TEM and APT Characterization. Microscopy and Microanalysis 2013, Indianapolis, IN, USA (2013)
Li, Y. J.; Choi, P.; Herbig, M.; Kostka, A.; Goto, S.; Borchers, C.; Raabe, D.; Kirchheim, R.: Atomic Scale Understanding of 6.8 GPa Ultra-high Strength Pearlite. 8th Pacific Rim International Congress on Advanced Materials and Processing (PRICM-8), Waikoloa, HI, USA (2013)
Raabe, D.; Choi, P.; Herbig, M.; Li, Y.; Zaefferer, S.; Kirchheim, R.: Iron – Mythology and High Tech: From Electronic Understanding to Bulk Nanostructuring of 1 Billion Tons. Summer School 2013 on Functional Solids – FERRUM - organized by Leibniz University Hannover, Goslar, Germany (2013)
Choi, P.-P.: Characterization of internal interfaces in Cu(In,Ga)Se2 thin-film solar cells using correlative microscopy. IEEE – Photovoltaic Specialist Conference, Denver, CO, USA (2013)
Cojocaru-Mirédin, O.; Choi, P.; Würz, R.; Raabe, D.: Exploring the internal interfaces in Cu(In,Ga)Se2 thin-film solar cells at the atomic-scale. 2013 MRS Spring Meeting & Exhibit, San Francisco, CA, USA (2013)
Max Planck team explains dendrite propagation, paving the way for safer and longer-lasting next-generation batteries. They publish their findings in the journal Nature.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…