Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: High temperature mechanical characterization of Copper-Silver- and Copper-Zirconium thin film libraries produced by combinatorial materials synthesis approach. Gordon Research Seminar on Thin Film and Small Scale Mechanical Behavior (GRS) 2018, Lewiston, ME, USA (2018)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: Mechanical characterization of copper thin films produced by photolithography with a novel microscale high temperature loading rig. The International Conference on Experimental Mechanics, (ICEM) 2018, Brussels, Belgium (2018)
Lee, S.; Liebscher, C.; Dehm, G.: In-situ TEM study on deformation behaviors of CrMnFeCoNi single crystal high entropy alloys. European Solid Mechanics Conference (ESMC) , Bologna, Italy (2018)
Li, J.; Dehm, G.; Kirchlechner, C.: Dislocation source activation by nanoindentation in single crystals and at grain boundaries. E-MRS Spring, Strasbourg, France (2018)
Duarte, M. J.; Fang, X.; Brinckmann, S.; Dehm, G.: New approaches for in-situ nanoindentation of hydrogen charged alloys: insights on bcc FeCr alloys. DPG Spring Meeting of the Condensed Matter Section, Berlin, Germany (2018)
The aim of the Additive micromanufacturing (AMMicro) project is to fabricate advanced multimaterial/multiphase MEMS devices with superior impact-resistance and self-damage sensing mechanisms.
This project studies the mechanical properties and microstructural evolution of a transformation-induced plasticity (TRIP)-assisted interstitial high-entropy alloy (iHEA) with a nominal composition of Fe49.5Mn30Co10Cr10C0.5 (at. %) at cryogenic temperature (77 K). We aim to understand the hardening behavior of the iHEA at 77 K, and hence guide the future design of advanced HEA for cryogenic applications.
The aim of this project is to correlate the point defect structure of Fe1-xO to its mechanical, electrical and catalytic properties. Systematic stoichiometric variation of magnetron-sputtered Fe1-xO thin films are investigated regarding structural analysis by transition electron microscopy (TEM) and spectroscopy methods, which can reveal the defect…