Schmidt, T.; Balk, T. J.; Dehm, G.; Arzt, E.: Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia 50 (6), pp. 733 - 737 (2004)
The full potential of energy materials can only be exploited if the interplay between mechanics and chemistry at the interfaces is well known. This leads to more sustainable and efficient energy solutions.
In this project, we employ a metastability-engineering strategy to design bulk high-entropy alloys (HEAs) with multiple compositionally equivalent high-entropy phases.