Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Effect of the atomic structure of complexions on the active disconnection mode during shear-coupled grain boundary motion. Physical Review Materials 8 (6), 063602 (2024)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)
Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)
Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research
Society
, Virtual (2021)
The aim of this project is to correlate the point defect structure of Fe1-xO to its mechanical, electrical and catalytic properties. Systematic stoichiometric variation of magnetron-sputtered Fe1-xO thin films are investigated regarding structural analysis by transition electron microscopy (TEM) and spectroscopy methods, which can reveal the defect…
The aim of this project is to develop novel nanostructured Fe-Co-Ti-X (X = Si, Ge, Sn) compositionally complex alloys (CCAs) with adjustable magnetic properties by tailoring microstructure and phase constituents through compositional and process tuning. The key aspect of this work is to build a fundamental understanding of the correlation between…
The aim of the Additive micromanufacturing (AMMicro) project is to fabricate advanced multimaterial/multiphase MEMS devices with superior impact-resistance and self-damage sensing mechanisms.