Influence of Chemical and Structural Complexity on Dislocation Processes 

Publications of Tobias Schmidt

All genres

Journal Article (1)

1.
Journal Article
Schmidt, T.; Balk, T. J.; Dehm, G.; Arzt, E.: Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia 50 (6), pp. 733 - 737 (2004)
MPG.PuRe
DOI

Other Interesting Articles

Web-View
Print Page
Open in new window
Estimated DIN-A4 page-width
Go to Editor View