Fink, C.; Brinckmann, S.; Dehm, G.: Nanotribology and Microstructure Evolution in Pearlite. 3rd European Symposium on Friction, Wear and Wear Protection, Karlsruhe, Germany (2014)
Malyar, N.; Dehm, G.; Kirchlechner, C.: Dislocation motion in bi-crystals with a specific grain boundary orientation studied by in situ SEM and in situ µLaue diffraction. Conference: Thin Film & Small Scale Mechanical Behavior Gordon Research , Waltham, MA, USA (2014)
Malyar, N.; Dehm, G.; Kirchlechner, C.: Dislocation motion in bi-crystals with a specific grain boundary orientation studied by in situ SEM and in situ µLaue diffraction. Seminar: Thin Film & Small Scale Mechanical Behavior Gordon Research , Waltham, MA, USA (2014)
Philippi, B.; Kirchlechner, C.; Schießl, A.; Schingale, A.; Dehm, G.: Improving lead-free solders by resolving mechanical properties at the microstructure length scale. Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Fracture behavior of gradient PtNiAl bond coats at the micron-scale using in-situ microbeam bend studies. 13th European Nanomechanical User Group Meeting, Oxford, UK (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Deformation behavior of thin Cu/Cr films on polyimide. Small Scale Plasticity School, Cargèse, Corsica, France (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion behavior of Cu–Cr thin films on polyimide substrate. ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints in automotive microelectronics. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)
Harzer, T. P.; Dehm, G.: Microstructural studies of Cu–Cr thin film structures grown by molecular beam epitaxy using advanced transmission electron microscopy. Macan Theromodynamics Workshop, Istanbul, Turkey (2012)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
Eiper, E.; Martinschitz, K. J.; Dehm, G.; Kečkéš, J.: Size effect in metallic thin films characterized by low-temperature X-ray diffraction. Gordon Research Conference on thin film & smallscale mechanical behavior , Colby College Waterville, Maine, USA (2006)
Rester, M.; Kiener, D.; Kreuzer, H. G.M.; Dehm, G.; Motz, C.: Microstructural investigation of the deformation zone below nanoindents in copper, silver and nickel. Hysitron Workshop and Usermeeting, München, Germany (2006)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Project C3 of the SFB/TR103 investigates high-temperature dislocation-dislocation and dislocation-precipitate interactions in the gamma/gamma-prime microstructure of Ni-base superalloys.
Within this project, we will investigate the micromechanical properties of STO materials with low and higher content of dislocations at a wide range of strain rates (0.001/s-1000/s). Oxide ceramics have increasing importance as superconductors and their dislocation-based electrical functionalities that will affect these electrical properties. Hence…
In this project, we aim to achieve an atomic scale understanding about the structure and phase transformation process in the dual-phase high-entropy alloys (HEAs) with transformation induced plasticity (TRIP) effect. Aberration-corrected scanning transmission electron microscopy (TEM) techniques are being applied ...
Grain boundaries are one of the most important constituents of a polycrystalline material and play a crucial role in dictating the properties of a bulk material in service or under processing conditions. Bulk properties of a material like fatigue strength, corrosion, liquid metal embrittlement, and others strongly depend on grain boundary…