Harzer, T. P.; Duarte, M. J.; Dehm, G.: In-situ TEM isothermal annealing of nanocrystalline supersaturated Cu–Cr thin film alloys. 80th Annual Conference of the DPG and DPG Spring Meeting, Regensburg, Germany (2016)
Jaya, B. N.; Köhler, M.; Schnabel, V.; Raabe, D.; Schneider, J. M.; Kirchlechner, C.; Dehm, G.: Micro-scale fracture behavior of Co based metallic glass thin films. 2016 TMS Annual Meeting and Exhibition Symposium: In Operando Nano- and Micro-mechanical Characterization of Materials with Special Emphasis on In Situ Techniques, Nashville, TN, USA (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Investigation of solid state dewetting phenomena of epitaxial Al thin films on sapphire using electron microscopy. The 16th European Microscopy Congress (EMC 2016), Lyon, France (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Solid state dewetting of epitaxial Al thin films on sapphire studied by electron microscopy. Materials Research Society Fall Meeting & Exhibition 2016 (MRS Fall 2016), Boston, MA, USA (2016)
Luo, W.; Kirchlechner, C.; Dehm, G.; Stein, F.: A New Method to Study the Composition Dependence of Mechanical Properties of Laves. MRS Fall Meeting 2016, Boston, MA, USA (2016)
Dehm, G.: Mikromechanik: lokale Einblicke in die mechanischen Eigenschaften von Materialien. Eröffnung des Christian Doppler Labors für
Lebensdauer und Zuverlässigkeit von Grenzflächen in komplexen Mehrlagenstrukturen der Elektronik „RELAB“, Vienna, Austria (2015)
Dehm, G.: New insights into the mechanical behavior of interface controlled metals. Colloquium Materials Modelling, Institut für Materialprüfung, Werkstoffkunde und Festigkeitslehre (IMWF), Universität Stuttgart , Stuttgart, Germany (2015)
Dehm, G.; Imrich, P. J.; Malyar, N.; Kirchlechner, C.: Differences in deformation behavior of bicrystalline Cu micropillars containing different grain boundaries. MS&T 2015 (Materials Science and Technology) meeting, symposium entitled "Deformation and Transitions at Grain Boundaries", Columbus, OH, USA (2015)
Dehm, G.; Zhang, Z.; Völker, B.: Structure and strength of metal-ceramic interfaces: New insights by Cs corrected TEM and advances in miniaturized mechanical testing. MS&T 2015 (Materials Science and Technology) meeting, Symposium entitled "Structures and Properties of Grain Boundaries: Towards an atomic-scale understanding of ceramics", Columbus, OH, USA (2015)
Dehm, G.; Harzer, T. P.; Völker, B.; Imrich, P. J.; Zhang, Z.: Towards New Insights on Interface Controlled Materials by Advanced Electron Microscopy. Frontiers of Electron Microscopy in Materials Science Meeting (FEMMS 2015), Lake Tahoe, CA, USA (2015)
Scientists of the Max-Planck-Institut für Eisenforschung pioneer new machine learning model for corrosion-resistant alloy design. Their results are now published in the journal Science Advances
Statistical significance in materials science is a challenge that has been trying to overcome by miniaturization. However, this process is still limited to 4-5 tests per parameter variance, i.e. Size, orientation, grain size, composition, etc. as the process of fabricating pillars and testing has to be done one by one. With this project, we aim to…
Atom probe tomography (APT) provides three dimensional(3D) chemical mapping of materials at sub nanometer spatial resolution. In this project, we develop machine-learning tools to facilitate the microstructure analysis of APT data sets in a well-controlled way.
Atom probe tomography (APT) is one of the MPIE’s key experiments for understanding the interplay of chemical composition in very complex microstructures down to the level of individual atoms. In APT, a needle-shaped specimen (tip diameter ≈100nm) is prepared from the material of interest and subjected to a high voltage. Additional voltage or laser…
Ever since the discovery of electricity, chemical reactions occurring at the interface between a solid electrode and an aqueous solution have aroused great scientific interest, not least by the opportunity to influence and control the reactions by applying a voltage across the interface. Our current textbook knowledge is mostly based on mesoscopic…