Kirchlechner, C.; Imrich, P. J.; Liegl, W.; Pörnbacher, J.; Micha, J.-S.; Ullrich, O.; Motz, C.: On the reversibility of dislocation slip during small scale low cycle fatigue. Acta Materialia 94, pp. 69 - 77 (2015)

Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, pp. 398 - 405 (2014)

Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, pp. 240 - 250 (2014)

Kirchlechner, C.; Grosinger, W.; Kapp, M. W.; Imrich, P. J.; Micha, J.-S.; Ulrich, O.; Kečkéš, J.; Dehm, G.; Motz, C.: Investigation of reversible plasticity in a micron-sized, single crystalline copper bending beam by X-ray μLaue diffraction. Philosophical Magazine 92 (25-27), pp. 3231 - 3242 (2012)

Yang, B.; Motz, C.; Rester, M.; Dehm, G.: Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires. Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III 92 (25-27), pp. 3243 - 3256 (2012)

Smolka, M.; Motz, C.; Detzel, T.; Robl, W.; Grießer, T.; Wimmer, A.; Dehm, G.: Novel temperature dependent tensile test of freestanding copper thin film structures. Review of Scientific Instruments 83 (6), 064702 (2012)

Moser, G.; Felber, H.; Rashkova, B.; Imrich, P. J.; Kirchlechner, C.; Grosinger, W.; Motz, C.; Dehm, G.; Kiener, D.: Sample Preparation by Metallography and Focused Ion Beam for Nanomechanical Testing. Praktische Metallographie-Practical Metallography 49 (6), pp. 343 - 355 (2012)

Oh, S. H.; Rentenberger, C.; Im, J.; Motz, C.; Kiener, D.; Karnthaler, H.-P.; Dehm, G.; Dehm, G.: Dislocation plasticity of Al film on polyimide investigated by cross-sectional in situ transmission electron microscopy straining. Scripta Materialia 65 (5), pp. 456 - 459 (2011)

Kirchlechner, C.; Kečkéš, J.; Motz, C.; Grosinger, W.; Kapp, M. W.; Micha, J.-S.; Ulrich, O.; Dehm, G.: Impact of instrumental constraints and imperfections on the dislocation structure in micron-sized Cu compression pillars. Acta Materialia 59 (14), pp. 5618 - 5626 (2011)

Kirchlechner, C.; Kiener, D.; Motz, C.; Labat, S.; Vaxelaire, N.; Perroud, O.; Micha, J.-S.; Ulrich, O.; Thomas, O.; Dehm, G. et al.; Kečkéš, J.: Dislocation storage in single slip-oriented Cu micro-tensile samples: New insights via X-ray microdiffraction. Philosophical Magazine 91 (7-9), pp. 1256 - 1264 (2011)

Matoy, K.; Detzel, T.; Müller , M.; Motz, C.; Dehm, G.: Interface fracture properties of thin films studied by using the micro-cantilever deflection technique. Surface and Coatings Technology 204 (6-7), pp. 878 - 881 (2009)

Matoy, K.; Schönherr, H.; Detzel, T.; Schöberl, T.; Pippan, R.; Motz, C.; Dehm, G.: A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films. Thin Solid Films 518 (1), pp. 247 - 256 (2009)

Yang, B.; Motz, C.; Grosinger, W.; Dehm, G.: Stress-controlled fatigue behaviour of micro-sized polycrystalline copper wires. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 515 (1-2), pp. 71 - 78 (2009)

Kiener, D.; Motz, C.; Dehm, G.: Micro-compression testing: A critical discussion of experimental constraints. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 505 (1-2), pp. 79 - 87 (2009)

Kiener, D.; Motz, C.; Dehm, G.; Pippan, R.: Overview on established and novel FIB based miniaturized mechanical testing using in-situ SEM. International Journal of Materials Research 100 (8), pp. 1074 - 1087 (2009)

Yang, B.; Motz, C.; Grosinger, W.; Kammrath, W.; Dehm, G.: Tensile behaviour of micro-sized copper wires studied by a novel fibre tensile module. International Journal of Materials Research 99 (7), pp. 716 - 724 (2008)

Kiener, D.; Motz, C.; Dehm, G.: Dislocation-induced crystal rotations in micro-compressed single crystal copper columns. Journal of Materials Science 43 (7), pp. 2503 - 2506 (2008)

Kiener, D.; Motz, C.; Rester, M.; Jenko, M.; Dehm, G.: FIB damage of Cu and possible consequences for miniaturized mechanical tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 459 (1-2), pp. 262 - 272 (2007)

Kiener, D.; Motz, C.; Schöberl, T.; Jenko, M.; Dehm, G.: Determination of mechanical properties of copper at the micron scale. Advanced Engineering Materials 8 (11), pp. 1119 - 1125 (2006)

Dehm, G.; Motz, C.; Scheu, C.; Clemens, H. J.; Mayrhofer, P. H.; Mitterer, C.: Mechanical size-effects in miniaturized and bulk materials. Advanced Engineering Materials 8 (11), pp. 1033 - 1045 (2006)