Publications of Gerhard Dehm

Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Fracture behavior of gradient PtNiAl bond coats at the micron-scale using in-situ microbeam bend studies. 13th European Nanomechanical User Group Meeting, Oxford, UK (2013)

Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Deformation behavior of thin Cu/Cr films on polyimide. Small Scale Plasticity School, Cargèse, Corsica, France (2013)

Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion behavior of Cu–Cr thin films on polyimide substrate. ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal (2013)

Brinckmann, S.; Dehm, G.: Nanotribology: Size-dependent friction coefficient and surface topology evolution. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)

Djaziri, S.; Li, Y.; Goto, S.; Dehm, G.: Microstructural characterization of cold-drawn pearlitic steel wires. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPI, Düsseldorf, Germany (2013)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints in automotive microelectronics. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)

Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of lead-free solder joints in microelectronics. Small Scale Plasticity School, Cargèse, Korsika, France (2013)

Harzer, T. P.; Dehm, G.: Microstructural studies of Cu–Cr thin film structures grown by molecular beam epitaxy using advanced transmission electron microscopy. Macan Theromodynamics Workshop, Istanbul, Turkey (2012)

Philippi, B.; Dehm, G.: Thermo-mechanical investigation of lead-free solder. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)

Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)

Eiper, E.; Martinschitz, K. J.; Dehm, G.; Kečkéš, J.: Size effect in metallic thin films characterized by low-temperature X-ray diffraction. Gordon Research Conference on thin film & smallscale mechanical behavior , Colby College Waterville, Maine, USA (2006)

Eiper, E.; Martinschitz, K. J.; Dehm, G.; Kečkéš, J.: Size effect in metallic thin films characterized by low-temperature X-ray diffraction. 55th Annual Denver X-ray Conference, Denver, CO, USA (2006)

Motz, C.; Kiener, D.; Schöberl, T.; Dehm, G.: Micron beam bending and compression tests - micromechanical properties of copper. 7th European Symposium on nano-mechanical testing, Hückelhoven, Germany (2006)

Rester, M.; Kiener, D.; Kreuzer, H. G.M.; Dehm, G.; Motz, C.: Microstructural investigation of the deformation zone below nanoindents in copper, silver and nickel. Hysitron Workshop and Usermeeting, München, Germany (2006)

Dehm, G.: Mechanische Eigenschaften in kleinen Dimensionen. Lecture: SS 2024, Ruhr-Universität Bochum, June 17, 2024 - June 25, 2024

Dehm, G.: Transmissionselektronenmikroskopie für Fortgeschrittene. Lecture: WS 2024/2025, Ruhr-Universität Bochum, 2024-10 - 2025-03

Dehm, G.; Scheu, C.: Atomare Charakterisierung von Werkstoffen. Lecture: WS 2024/2025, Heinrich-Heine Universität Düsseldorf, October 26, 2024 - February 12, 2025

Dehm, G.: Mechanische Eigenschaften in kleinen Dimensionen. Lecture: SS 2023, Ruhr-Universität Bochum, June 01, 2023 - June 30, 2023