Scheu, C.: Interface structure of Kappa-Carbides in high Mn Steels. 3 Phase, Interface, Component Systems (PICS), Centre Interdisciplinaire de Nanoscience de Marseille (CINaM), Marseille, France (2017)
Raabe, D.; Gault, B.; Yao, M.; Scheu, C.; Liebscher, C.; Herbig, M.: Correlated and simulated electron microscopy and atom probe tomography. Workshop on Possibilities and Limitations of Quantitative Materials Modeling and Characterization 2017, Bernkastel, Germany (2017)
Scheu, C.: Grain growth and dewetting of thin Al films on (0001) Al2O3 substrates. 3 Phase, Interface, Component Systems (PICS), Centre Interdisciplinaire de Nanoscience de Marseille (CINaM), Marseille, France (accepted)
Scheu, C.: In-situ Transmission Electron Microscopy Observation of Heat-Induced Structural Changes of 3D Nb3O(OH) Networks. Electronic Materials and Applications 2017 (EMA), Orlando, FL, USA (2017)
Scheu, C.: Insights into structural and functional properties of Nb3O7(OH) and TiO2 nanoarrays. European Materials Research Society’s (EMRS) Fall Meeting, Warsaw, Poland (2016)
Scheu, C.: Transmission electron microscopy – a versatile tool to study the microstructure of HT-PEMFC. Materials Science 2016, Atlanta, GA, USA (2016)
Scheu, C.: Insights into structural and functional properties of nano-structured electrodes for energy and fuel generating devices. Talk at Helmholtz‐Zentrum Geesthacht, Geesthacht, Germany (2016)
Scheu, C.: Correlative STEM & Atom Probe Tomography (ATP): Insights in the k-carbide/austenite interface. Workshop on “New trends in electron microscopy”, Ringberg Castle, Kreuth am Tegernsee, Germany (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
Here the focus lies on investigating the temperature dependent fracture of materials down to the individual microstructural length-scales, such as respective phases, grain/phase boundaries or hetero-interfaces, to understand brittle-ductile transitions in deformation and the role of chemistry or crystallography on it.
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.