Grundmeier, G.; Fink, N.; Giza, M.; Popova, V.; Vlasak, R.; Wapner, K.: Application of combined spectroscopic, electrochemical and microscopic techniques for the understanding of adhesion and de-adhesion at polymer/metal interfaces. 24. Spektrometertagung, Dortmund, Germany (2005)
Grundmeier, G.; Wapner, K.: Anwendung einer neuen höhenregulierbaren Rasterkelvinsonde zur Untersuchung der Stabilität von Klebstoff-Metall-Grenzflächen in feuchten und korrosiven Atmosphären. Swissbonding, Rapperswil am Zürichsee, Switzerland (2005)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Fundamentals and Applications of a new height regulated Scanning Kelvin Probe in Corrosion and Adhesion Science. ISE 2004, Thessaloniki, Greece (2004)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Introduction of a height regulated Scanning Kelvin Probe for the simultaneous measurement of surface topography and interfacial electrode potentials in corrosive environments. ISE Conference, 55th Annual Meeting, Thessaloniki, Greece (2004)
Grundmeier, G.; Wapner, K.: Water diffusion measurements in a model adhesive/silicon lap joint using FTIR-spectroscopy: Differentiation between bulk and interfacial diffusion. Euradh 2004, Freiburg, Germany (2004)
Wapner, K.; Grundmeier, G.: Extended Abstract: Water diffusion measurements in a model adhesive/silicon lap joint using FTIR-spectroscopy: differentiation between bulk and interfacial diffusion. Euradh2004/Adhesion2004, Freiburg, Germany (2004)
Wapner, K.; Stratmann, M.; Grundmeier, G.: Extended Abstract: Non-destructive, in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new scanning Kelvin probe blister Test. Euradh2004/Adhesion2004, Freiburg, Germany (2004)
Grundmeier, G.; Wapner, K.; Stratmann, M.: Applications of a new height regulated Scanning Kelvin Probe for the study of polymer/metal interfaces in corrosive environments. ICEPAM 2004, Helsinki, Finnland (2004)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Non-destructive, real time in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new Scanning Kelvin Probe Blister Test. Annual Meeting of the American Adhesion Society, Wilmington, UK (2004)
Wapner, K.; Grundmeier, G.: Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces. Annual Meeting of the American Adhesion Society, Wilmington, UK (2004)
Posner, R.; Wapner, K.; Stratmann, M.; Grundmeier, G.: Hydrated Ion Transport at Polymer/Oxide/Metal-Interfaces in Non-Corrosive Atmosphere: Influence of Electric Field Gradients. Gordon Conference Graduate Research Seminar on Aqueous Corrosion, Colby Sawyer College, New London, NH, USA (2008)
Klimow, G.; Wapner, K.; Grundmeier, G.: Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load. 3rd World Congress on Adhesion and Related Phenomena, WCARP-III, Beijing, China (2006)
Wapner, K.; Stratmann, M.; Grundmeier, G.: Non-destructive, In-Situ Measurement of De-Adhesion Processes at Buried Adhesive/Metal Interfaces by Means of a New Scanning Kelvin Probe Blister Test. EUROMAT 2005, Prague, Czech Republic (2005)
Wapner, K.; Stratmann, M.; Grundmeier, G.: The application of the scanning Kelvin probe for investigating the deadhesion of adhesives on iron and zinc. EURADH 2002, Glasgow, UK (2002)
Wapner, K.: Grenzflächenchemische und elektrochemische Untersuchungen zur Haftung und Enthaftung an modifizierten Klebstoff/Metall-Grenzflächen. Dissertation, Ruhr-Universität Bochum, Fakultät für Chemie, Bochum, Germany (2006)
Scientists of the Max-Planck-Institut für Eisenforschung pioneer new machine learning model for corrosion-resistant alloy design. Their results are now published in the journal Science Advances
Atom probe tomography (APT) is one of the MPIE’s key experiments for understanding the interplay of chemical composition in very complex microstructures down to the level of individual atoms. In APT, a needle-shaped specimen (tip diameter ≈100nm) is prepared from the material of interest and subjected to a high voltage. Additional voltage or laser…
Ever since the discovery of electricity, chemical reactions occurring at the interface between a solid electrode and an aqueous solution have aroused great scientific interest, not least by the opportunity to influence and control the reactions by applying a voltage across the interface. Our current textbook knowledge is mostly based on mesoscopic…
Recent developments in experimental techniques and computer simulations provided the basis to achieve many of the breakthroughs in understanding materials down to the atomic scale. While extremely powerful, these techniques produce more and more complex data, forcing all departments to develop advanced data management and analysis tools as well as…
Integrated Computational Materials Engineering (ICME) is one of the emerging hot topics in Computational Materials Simulation during the last years. It aims at the integration of simulation tools at different length scales and along the processing chain to predict and optimize final component properties.