Changizi, R.: Structural Analysis and Correlative Cathodoluminescence Investigations of Pr (doped) Niobates. Dissertation, Georessourcen und Materialtechnik, RWTH Aachen (2022)
Gomell, L.: Advancing the understanding of the microstructure-property relationship in non-toxic and cost-effective thermoelectric Heusler compounds. Dissertation, Fakultät für Georessourcen und Materialtechnik der RWTH Aachen, Germany (2022)
Abdellaoui, L.: Correlation of microstructures and thermal conductivity of the thermoelectric material Ag16.7Sb30Te53.3. Dissertation, Ruhr-Universität Bochum (2019)
Sysoltseva, M.: Characterization of aerosols and nanoparticles released during various indoor and outdoor human activities. Dissertation, RWTH Aachen University (2018)
Folger, A.: The Influence of Post-Growth Heat Treatments and Etching on the Nanostructure and Properties of Rutile TiO2 Nanowires. Dissertation, RWTH Aachen, Aachen, Germany (2017)
Gleich, S.: Investigation of Sputtered Mo2BC Hard Coatings: Correlation of Nanostructure and Mechanical Properties. Dissertation, RWTH Aachen, Aachen, Germany (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…