Brognara, A.; Best, J. P.; Djemia, P.; Faurie, D.; Dehm, G.; Ghidelli, M.: Toward engineered thin film metallic glasses with large mechanical properties: effect of composition and nanostructure. Seminar at Laboratoire des Sciences des Procédés et des Matériaux (LSPM), Paris Nord University, Paris, France (2021)
Brognara, A.; Nasri, I. F. M. A.; Bricchi, B. R.; Li Bassi, A.; Gauchotte, C.; Ghidelli, M.; Lidgi-Guigui, N.: Detection of estradiol by a SERS sensor based on TiO2 covered with gold nanoparticles. Applied Nanotechnology and Nanoscience International Conference – ANNIC 2019, Paris, France (2019)
Brognara, A.; Best, J. P.; Djemia, P.; Faurie, D.; Ghidelli, M.; Dehm, G.: On the mechanical properties and thermal stability of ZrxCu100-x thin film metallic glasses with different compositions. Nanobrücken 2021 - Nanomechanical Testing Conference virtual event, Düsseldorf, Germany (2021)
Brognara, A.; Best, J. P.; Djemia, P.; Faurie, D.; Ghidelli, M.; Dehm, G.: Effect of composition on mechanical properties and thermal stability of ZrCu thin film metallic glasses. European Materials Research Society (E-MRS) Spring Meeting 2021, Virtual Conference, Strasbourg, France (2021)
Devulapalli, V.; Frommeyer, L.; Ghidelli, M.; Liebscher, C.; Dehm, G.: From epitaxially grown thin films to grain boundary analysis in Cu and Ti. International Workshop on Advanced and In-situ Microscopies of Functional Nanomaterials and Devices, IAMNano, Düsseldorf, Germany (2019)
Brognara, A.: Design of ZrCu thin film metallic glasses with tailored mechanical properties through control of composition and nanostructure. Dissertation, RUB Bochum, Bochum, Germany (2025)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
Here the focus lies on investigating the temperature dependent fracture of materials down to the individual microstructural length-scales, such as respective phases, grain/phase boundaries or hetero-interfaces, to understand brittle-ductile transitions in deformation and the role of chemistry or crystallography on it.
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.